DIP LED Lead Frame Integration for Simplified Manufacturing
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Solution Overview
Problem
Conventional dual in-line package (DIP) LEDs have a complex manufacturing process, leading to increased manufacturing costs.
Innovation Solution
A DIP LED device design featuring an electrically insulative molded member with conductive parallel leads and an elongated LED body, where the leads are soldered to conductive members and the molded member is formed through plastic injection molding, simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional DIP LED manufacturing processes are used, then reliable electrical connections are achieved, but the manufacturing process becomes complicated and costs increase
Solution Approach 1:
The patent merges the lead frame structure with the molded member by injecting the molded material directly over the leads during the molding process. This integration eliminates separate assembly steps for securing leads to the housing, simplifying manufacturing while maintaining reliable electrical connections through the embedded lead structure.
Solution Approach 2:
The molded member serves multiple functions: it provides structural housing, electrical insulation, and mechanical support for the LED components. By combining these functions into a single component, the patent reduces the number of parts and assembly steps, thereby simplifying manufacturing without compromising connection reliability.
2Ease of manufacture
If conventional DIP LED manufacturing processes are used, then stable electrical connections are achieved, but equipment processing costs increase
Solution Approach 1:
The leads are pre-positioned and pre-soldered to the LED components before the final molding step. This preliminary assembly allows the molding process to simply encase the pre-assembled unit, reducing the need for complex post-molding assembly equipment and operations while ensuring stable connections are established early in the process.
Solution Approach 2:
The molding process itself serves to secure and protect the electrical connections by encapsulating the leads and components in a single integrated housing. The molded material automatically provides both structural support and electrical insulation, eliminating the need for separate insulation components or additional securing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process and reduces equipment processing costs while ensuring stable electrical connections.
Implementation Method 1
The molded member 1 is electrically insulative and made by plastic injection molding
Implementation Method 2
The top ends of the positive lead 2 and the negative lead 3 are respectively soldered to the two conductive members
Data Source
AI summary
A dual in-line package (DIP) light emitting diode (LED) device includes a molded member, a positive lead passing through and fixed to the molded member, the positive lead comprising an upper end and lower end, a negative lead passing through and fixed to the molded member, the negative lead comprising an upper end and lower end, and at least one LED body connected to the top ends of the positive lead and the negative lead. The lower ends of the positive lead and the negative lead are flush with each other. The top end of the positive lead is higher than the top end of the negative lead. The positive lead and the negative lead are both bent at the top ends thereof.