DIP Pin Detection Using Serial Height Images
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Solution Overview
Problem
In mass production of electronic components using dual-in-line packages (DIPs), existing methods face challenges with uneven surfaces, pin deformation, and errors in pin length due to cutting processes, leading to difficulties in determining the qualification of components for smooth insertion onto circuit boards.
Innovation Solution
A method and system utilizing a pick and place device and image acquiring device to capture serial images of pins at different heights, detect image positions, and determine the qualification of electronic components based on pin distance and position relationships, enabling precise insertion onto circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If image processing is used to detect pin positions in the known art, then the insertion process can be automated, but the detection accuracy is affected by uneven surfaces, pin deformation, and length errors caused by cutting processes
Solution Approach 1:
The patent applies preliminary action by performing image acquisition at multiple heights before the insertion process. The imaging device captures images of the electronic component at different heights along the image acquiring direction, allowing the system to detect pin positions and assess component quality (surface uniformity, pin deformation, pin length) before insertion occurs. This preliminary detection enables qualification determination and position estimation without requiring perfect detection accuracy during the actual insertion moment.
2Manufacturing precision
If multiple serial images are acquired at different heights, then pin deformation and surface issues can be accurately analyzed, but the detection process becomes more complex
Solution Approach 1:
The patent applies dimensionality change by introducing the height dimension to the image acquisition process. Instead of capturing a single image at one height, the system acquires multiple serial images at different heights along the image acquiring direction. This adds a vertical dimension to the detection process, enabling the system to analyze pin deformation, surface uniformity, and pin length by comparing images across different height levels, thereby improving manufacturing precision without requiring overly complex lateral detection systems.
3Adaptability or versatility
If manual labor is used for DIP component assembly, then flexibility is maintained, but productivity is low and labor costs are high
Solution Approach 1:
The patent applies mechanics substitution by replacing manual mechanical handling with an automated pick-and-place device guided by image processing. The system uses imaging devices to detect pin positions and component characteristics, then automatically controls the pick-and-place device to insert components at correct positions. This substitution maintains adaptability through image-based position estimation while dramatically improving productivity by eliminating manual labor and enabling consistent high-speed assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces insertion errors and improves yield by accurately analyzing pin deformation and surface issues, ensuring smooth and precise pin insertion onto circuit boards.
Implementation Method 1
positions of pins of the electronic component are detected through image processing in the known art
Data Source
AI summary
A method and system for pins detection and insertion of an electronic component are provided. The method includes picking an electronic component having a plurality of pins by a pick and place device, acquiring a plurality of serial images with respect to the plurality of pins at different height along an image acquiring direction by an image acquiring device, separately detecting image positions corresponding to the plurality of pins in the plurality of serial images, determining whether the electronic component is qualified according to a distance between the image positions of two adjacent pins, and if the electronic component is qualified, inserting the electronic component to a circuit board according to a position relationship between the image positions of the pins and a geometric center position of the pick and place device.