Single-Piece Dipole Antenna Structure to Reduce PIM
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Solution Overview
Problem
Existing mobile communication antennas face issues with passive intermodulation (PIM) problems, limited electrical performance, material limitations, and high production costs due to die-cast materials, which also result in heavy and complex structure challenges.
Innovation Solution
A mobile communication antenna with a radiator design featuring integrally formed dipoles and support surfaces, using a single-piece construction and solder-free connections, coupled to ground via a dielectric layer, allowing flexible signal feeding and reduced PIM.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If die-cast metal material is used for the radiator, then structural strength is improved, but passive intermodulation (PIM) problems occur and electrical performance decreases
Solution Approach 1:
The patent changes the material parameter from die-cast metal to aluminum sheet material, fundamentally altering the physical and electrical properties of the radiator. This material substitution eliminates PIM problems while maintaining structural integrity through the inherent properties of aluminum and the optimized geometric design of the radiator elements.
Solution Approach 2:
The patent employs a composite construction approach by combining aluminum sheet material with plastic insulation material. The aluminum provides structural strength and electrical conductivity, while the plastic provides insulation and mechanical support, creating a composite radiator structure that optimizes both strength and electrical performance.
2Productivity
If die-cast process is used for radiator production, then mass production capability is improved, but production costs increase and adaptability decreases
Solution Approach 1:
The patent replaces the complex die-cast mechanical process with a simpler cutting and forming process using plastic sheet material. This substitution eliminates the need for expensive die-casting equipment and tools, significantly reducing production costs while maintaining the ability to mass-produce radiators through standardized cutting and assembly operations.
3Strength
If die-cast radiator with thicker walls is used, then structural strength is improved, but weight increases
Solution Approach 1:
The patent changes the wall thickness parameter by using thin aluminum sheet material instead of thick die-cast walls. The high strength-to-weight ratio of aluminum allows the radiator to maintain structural strength with significantly reduced wall thickness, thereby reducing overall weight while preserving mechanical integrity.
4Reliability
If solder joints are used for connecting signal lines to radiator, then electrical connection is improved, but PIM problems occur and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the soldering process from the manufacturing procedure. By designing the radiator with pre-formed connection points and using mechanical or conductive adhesive connections, the patent removes the source of PIM problems associated with solder joints while maintaining reliable electrical connections between signal lines and the radiator.
Solution Approach 2:
The patent introduces an intermediary connection method (such as conductive adhesive or mechanical connectors) to replace direct solder joints. This intermediary approach provides reliable electrical connection without the harmful effects of soldering, reducing PIM while maintaining connection integrity.
Data Source
AI summary
A mobile communication antenna with at least one radiator that comprises first and second dipoles, which comprise first and second dipole halves. Each dipole half comprises first and second connecting elements, which comprise first and second ends. Each connecting element is arranged with its first end on a support arrangement and extends away from it. The second ends of the first and second connecting elements of the respective dipole half are connected to one another via a radiator structure of the respective dipole half. Each dipole half is, via the first and/or second connecting element feedable and connected or coupled to ground.