Direct Backlight Module Heat Insulation Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The accumulation of heat from electrical elements and light sources in conventional direct type backlight modules reduces light emitting efficiency by about 10%, as heat affects both the light source and electrical elements, leading to increased air temperature and decreased performance.
Innovation Solution
Incorporating a heat-insulating element between the back bezel and circuit board to create separate convection spaces for heat from the light source and electrical elements, allowing for independent heat radiation and reducing temperature-related efficiency losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a distance is introduced between the back bezel and driving elements to enable heat convection, then heat dissipation is improved, but the device structure becomes more complex and space is wasted
Solution Approach 1:
A heat insulating element is introduced as an intermediary component between the back bezel and circuit board. This element actively manages heat by reflecting it back to the heat source while providing a thin barrier, achieving effective heat dissipation without requiring large spacing distances.
Solution Approach 2:
The patent changes the thermal parameters by introducing a heat insulating element with specific thermal reflection properties. This transforms the heat management approach from passive convection through spacing to active thermal reflection, improving heat dissipation efficiency while maintaining compact dimensions.
2Temperature
If heat is allowed to accumulate around electrical elements for convection, then heat dissipation occurs, but light emitting efficiency decreases by about 10%
Solution Approach 1:
The heat insulating element acts as a mediator that reflects heat back to the source, creating a controlled thermal environment. This prevents heat from spreading to the light source area, maintaining light emitting efficiency while still enabling heat dissipation through the reflected heat path.
Solution Approach 2:
The patent segments the internal space by introducing the heat insulating element, creating distinct thermal zones. This segmentation separates the heat generation area from the light source area, allowing independent thermal management for each component to optimize both heat dissipation and light emitting efficiency.
3Device complexity
If heat from light source and electrical elements accumulates together, then convection is simplified, but both components suffer from increased temperature and reduced performance
Solution Approach 1:
The heat insulating element segments the convection path into separate zones for the light source and electrical elements. While this adds a component, it creates more efficient thermal management by preventing heat cross-contamination, thereby improving component reliability and performance.
Solution Approach 2:
The patent applies local quality by positioning the heat insulating element specifically between the back bezel and circuit board. This localized intervention creates different thermal characteristics in different areas, with the heat reflection effect concentrated where needed to protect the light source while maintaining overall system simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat-insulating element decreases the efficiency loss to about 5%, enhancing heat radiation and maintaining optimal light emitting efficiency by preventing heat interaction between different sources, with improved temperature management.
Implementation Method 1
the heat-insulating element may be a heat-insulating plate for reflecting the heat back to the heat source
Implementation Method 2
an air enters the space 24 from a down side thereof and moves upwards... The convection process will make the heat accumulated around the electrical elements
Data Source
AI summary
A direct type backlight module comprises a back bezel, a light source, a circuit board, and a heat-insulating element. The light source comprising a plurality of driving elements coupled thereto is disposed within the back bezel. The circuit board is disposed outside the back bezel. The heat-insulating element is disposed between the back bezel and the circuit board so as to form a first convectional space and a second convectional space.