Direct-Bond Copper Inductive Coil Assembly for Dielectric Breakdown Resistance
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Solution Overview
Problem
Current inductive coil assemblies for wireless power transfer face challenges in achieving high power transfer efficiency and reliability, particularly at high frequencies and power levels required for applications like electric vehicles, due to issues such as dielectric breakdown and complexity in manufacturing.
Innovation Solution
A method of producing an inductive coil assembly involving a direct bond copper process between copper conductors and ceramic layers, which creates a strong bond and allows for high power operation without dielectric breakdown, using a multilayer structure of copper and ceramic with high adhesion, and patterning the conductors to achieve the desired resonant frequency and quality factor, while reducing material costs and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional multi-layer conductor structures are used for high power wireless power transfer, then power transfer capability can be increased, but dielectric breakdown and manufacturing complexity increase
Solution Approach 1:
The patent removes the dielectric material from between the copper layers, extracting the problematic component that causes dielectric breakdown. The copper layers are directly bonded together without any insulating material, eliminating the dielectric breakdown issue while maintaining high power transfer capability through the direct copper-copper contact and ceramic support structure.
Solution Approach 2:
The invention uses a composite structure combining copper conductors with ceramic substrates. The ceramic provides mechanical support and electrical isolation where needed, while the copper layers provide conductive paths for power transfer. This composite approach allows high power operation without the dielectric breakdown problems of traditional multi-layer conductor structures.
2Power
If complex multi-layer conductor assemblies are used to achieve high power levels, then power transfer efficiency improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the wireless power transfer system into separate functional modules: the coil assembly and the reflector array. This segmentation allows each component to be manufactured and optimized independently, reducing overall manufacturing complexity while maintaining high power transfer efficiency through the coordinated operation of these simplified modules.
Solution Approach 2:
The invention replaces complex mechanical multi-layer conductor assemblies with a simpler system using magnetic reflection principles. Instead of relying on complex stacked conductors, the system uses a reflector array that manipulates magnetic fields to achieve high power transfer, significantly simplifying the manufacturing process while maintaining efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of inductive coils that operate efficiently at high power levels and frequencies, such as 85 kHz, with a compact design, suitable for applications like electric vehicles, and can withstand higher power requirements without shorting or melting, while maintaining cost-effectiveness.
Implementation Method 1
A method of producing an inductive coil assembly involving a direct bond copper process between copper conductors and ceramic layers, which creates a strong bond and allows for high power operation without dielectric breakdown
Implementation Method 2
Low loss inductive coils with integrated capacitance are useful in the field of inductive wireless power transfer, among other technical fields requiring high-performance magnetic components capable of operating at high-frequency alternating current
Data Source
AI summary
A method of producing an inductive coil assembly includes forming N(i) layers, (i) being an integer from 1 to M, N(i) being an i-th layer, and N(M) being a maximum number of N(i) layers; stacking and registering the N(1) to N(M) layers such that for (i=1 to M−1), an instance of the first conductor of an N(i+1) layer is adjacent an instance of the second conductor of an N(i) layer; stacking and registering a third conductor having a thickness with the first conductor of the N(1) layer, and a fourth conductor having a thickness with the second conductor of the corresponding N(M) layer; and bonding the third conductor to the first conductor of the N(1) layer, and the fourth conductor to the second conductor of the N(M) layer.