Direct Bonding Display Panel to PCB Reduces Frame Width
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Solution Overview
Problem
Existing display devices face challenges in minimizing the width of their frames and maximizing the screen ratio, which affects visual effects and user experience.
Innovation Solution
A display device design that includes a display panel with a first bonding region containing a first bonding terminal, and a printed circuit board with a second bonding region containing a second bonding terminal connected to the first bonding terminal, eliminating the need for a flexible circuit board and reducing frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible circuit board is used to connect the display panel and printed circuit board, then the connection is reliable, but the frame width increases and screen ratio decreases
Solution Approach 1:
The patent extracts and eliminates the flexible circuit board from the connection system between the display panel and printed circuit board. By directly bonding the display panel to the printed circuit board through bonding terminals, the flexible circuit board is removed entirely, thereby reducing frame width while maintaining connection reliability through the direct bonding interface.
Solution Approach 2:
The patent merges the connection function into the direct bonding interface between the display panel and printed circuit board. The bonding terminals on both components are directly coupled together, combining the connection and signal transmission functions into a single integrated interface, eliminating the need for a separate flexible circuit board and reducing overall frame width.
2Length of stationary object
If the frame width is reduced to increase screen ratio, then the visual effects improve, but the manufacturing complexity increases
Solution Approach 1:
The patent segments the bonding interface into distinct bonding terminals on both the display panel and printed circuit board. This segmentation allows for precise alignment and independent optimization of each bonding point, simplifying the manufacturing process despite the reduced frame width and increased screen ratio requirements.
Solution Approach 2:
The patent changes the bonding parameters and interface design to accommodate the reduced frame width. By optimizing the bonding terminal dimensions, positioning precision, and bonding process parameters, the manufacturing complexity is managed while achieving the desired reduced frame width and increased screen ratio.
3Length of stationary object
If bonding terminals are directly connected without flexible circuit board, then the frame width decreases, but the bonding precision requirements increase
Solution Approach 1:
The patent incorporates preliminary positioning structures and pre-alignment features on both the display panel and printed circuit board. These preliminary actions ensure that the bonding terminals are correctly positioned before the actual bonding process, reducing the precision requirements during the bonding operation while maintaining the reduced frame width design.
Data Source
AI summary
The present application discloses a display device, the display device includes: a display panel and a printed circuit board. A first bonding region is disposed on the display panel. The first bonding region includes a first bonding terminal. A second bonding region is disposed on the printed circuit board. The second bonding region includes a second bonding terminal. The first bonding terminal is connected to and contacts the second bonding terminal. The display device provided by the present application can reduce a width of a frame of the display device and improve a screen ratio of the display device.