Direct-Bonded Obstructive Layer for Secure Semiconductor Chips
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Solution Overview
Problem
Existing semiconductor chips face challenges in securing security-sensitive components from unauthorized access and reverse engineering due to the limitations of conventional materials and processing techniques, which are either thermally incompatible or chemically incompatible with standard semiconductor processing.
Innovation Solution
The integration of a protective element comprising an obstructive material, such as abrasive and light-blocking materials, directly bonded to the semiconductor element without an adhesive, which physically damages or blocks access to sensitive circuitry, using dielectric-to-dielectric bonding techniques to enhance security.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials and processing techniques are used to protect security-sensitive components, then the protective element can be removed or accessed by third parties, but if obstructive materials are used, then the security is enhanced but the material is thermally or chemically incompatible with standard semiconductor processing
Solution Approach 1:
The protective structure is divided into multiple layers: a first protective layer applied during standard semiconductor processing, and a second obstructive layer applied afterward. This segmentation allows each layer to be optimized for its specific function while maintaining compatibility with the manufacturing process.
Solution Approach 2:
A first protective layer serves as an intermediary between the semiconductor substrate and the second obstructive layer. This intermediary layer provides a compatible interface that allows the obstructive material to be bonded to the chip without requiring direct compatibility with standard semiconductor processing conditions.
2Strength
If an adhesive is used to bond the protective element to the semiconductor element, then the bonding is simplified, but if no adhesive is used with direct bonding, then the bond strength and reliability are improved
Solution Approach 1:
The adhesive layer is completely removed from the bonding structure. Instead of using an adhesive, the patent employs direct bonding between the first protective layer and the semiconductor substrate, eliminating the intermediate adhesive material and its associated reliability issues.
Solution Approach 2:
The bonding interface itself provides the necessary bonding mechanism through direct material-to-material contact. The surfaces are prepared and bonded directly without requiring an external adhesive agent, allowing the structure to bond through its own inherent properties.
3Reliability
If the obstructive material is positioned close to the bonding interface, then the security protection is maximized, but if positioned far from the interface, then the bonding process is simplified
Solution Approach 1:
The first protective layer is prepared in advance during the semiconductor fabrication process, creating a pre-formed bonding interface. This preliminary preparation allows the obstructive second layer to be positioned optimally close to the bonding interface without complicating the bonding process itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents unauthorized access and reverse engineering by physically damaging removal tools or blocking electromagnetic interference, thus significantly enhancing the security of semiconductor chips.
Implementation Method 1
a bonding layer configured to directly bond the obstructive element to the semiconductor element without an adhesive
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry and a first bonding layer. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over the active circuitry and a second bonding layer on the obstructive material. The second bonding layer can be directly bonded to the first bonding layer without an adhesive. The obstructive material can be configured to obstruct external access to the active circuitry.