Embedded Cooling Manifold for Direct-Bonded Multi-Chip Packages
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Solution Overview
Problem
Current cooling systems for microelectronic devices face inefficiencies due to high thermal resistance, particularly in multi-chip and multi-cold-plate device packages, which hinder effective heat dissipation and increase energy consumption in data centers, where elevated temperatures can degrade chip performance and reduce reliability.
Innovation Solution
The implementation of integrated cooling assemblies with direct bonding of cold plates to semiconductor devices, eliminating thermal interface materials and reducing thermal resistance by using direct or hybrid bonding techniques, and a manifold system for efficient coolant flow across multiple cold plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If thermal interface materials are used to facilitate heat transfer between chip and heat dissipation device, then ease of manufacture is improved, but thermal resistance increases and cooling efficiency deteriorates
Solution Approach 1:
The patent removes thermal interface materials from the heat transfer path between the chip and heat dissipation device. By directly bonding the heat dissipation device to the chip using hybrid bonding techniques, the patent extracts the problematic TIM layer that was causing thermal resistance, thereby improving cooling efficiency while maintaining ease of manufacture through standardized bonding processes.
Solution Approach 2:
The patent merges the chip and heat dissipation device into a single integrated structure through direct bonding. This integration eliminates the separate TIM layer and creates a unified thermal management system, reducing thermal resistance and improving heat transfer efficiency while simplifying the overall device architecture.
2Temperature
If multiple cold plates are used in multi-chip device packages to combat increased heat production, then heat dissipation capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent segments the device package into multiple independent chip-cold plate units, each with its own dedicated cold plate. This segmentation allows each cold plate to be optimized for its specific chip's thermal requirements while maintaining overall system efficiency. The modular approach manages complexity by creating repeatable units rather than a monolithic complex structure.
Solution Approach 2:
The patent creates a universal manifold structure that can serve multiple cold plates simultaneously. This universal manifold design provides a common coolant distribution system that works with any number of cold plates, reducing the complexity that would otherwise arise from needing separate coolant systems for each cold plate. The manifold enables multi-functionality by serving multiple thermal management zones through a single integrated component.
3Ease of manufacture
If conventional cooling systems with multiple components are used between heat dissipating sources and heat dissipation devices, then ease of assembly is improved, but thermal resistance accumulates and cooling efficiency decreases
Solution Approach 1:
The patent merges multiple separate cooling components into a single integrated heat dissipation device that includes the cold plate, coolant channels, and bonding structure as one unified component. This integration eliminates the need for multiple separate components and their associated interfaces, thereby reducing cumulative thermal resistance while maintaining ease of assembly through a single bonding operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat transfer efficiency, reduces energy consumption, and improves the reliability and performance of microelectronic devices by minimizing thermal resistance and optimizing coolant flow within the device package.
Implementation Method 1
a first cold plate bonded to a backside of the first semiconductor device... allow coolant to flow through one or more coolant channels of the manifold and into one or more inlets of the first cold plate
Implementation Method 2
coolant to flow through one or more coolant channels of the manifold and into one or more inlets of the first cold plate... flow through one or more outlets of the first cold plate and into a first coolant chamber volume of the manifold
Data Source
AI summary
A device package comprising a cooling system. The cooling system comprises a first substrate, a first semiconductor device located on a first region of the first substrate, a second semiconductor device located on a second region of the first substrate, a first cold plate attached to the first semiconductor device, a second cold plate attached to the second semiconductor device, and a manifold having a first chamber volume and a second chamber volume. The first chamber volume comprises a first inlet coupled to a first coolant line, a first outlet coupled to the first cold plate, and a second outlet coupled to the second cold plate. The second chamber volume comprises a third outlet coupled to a second coolant line, a second inlet coupled to the first cold plate, and a third inlet coupled to the second cold plate.