Direct-Bonded Interconnect Structure for Die Alignment
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Solution Overview
Problem
Existing bonded structures face misalignment issues between conductive portions of a redistribution layer (RDL) and contact pads of electronic components, leading to manufacturing challenges, especially in reconstituted wafers with multiple integrated device dies.
Innovation Solution
Direct bonding techniques are employed to align semiconductor elements without adhesives, using dielectric-to-dielectric and conductor-to-conductor bonds, with polished and activated surfaces, and nitrogen or oxygen plasma treatments to enhance bonding, allowing for high-density interconnects and improved alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a deposited RDL is used to connect electronic components, then signal routing is achieved, but misalignment between conductive portions and contact pads occurs
Solution Approach 1:
Instead of depositing the RDL onto the electronic component and hoping for alignment, the patent inverts the approach by forming the RDL on a separate carrier substrate first, then bonding the entire assembly together. This allows the RDL to be pre-formed with precise conductive traces before the bonding step, eliminating alignment issues between the RDL and contact pads.
Solution Approach 2:
The patent divides the structure into separate segments: the electronic component, the carrier substrate, and the RDL formed on the carrier. This segmentation allows each component to be independently prepared and optimized, with the RDL precisely formed on the carrier before final assembly, thereby solving the alignment problem.
2Manufacturing precision
If direct bonding is used to mount semiconductor elements, then alignment precision is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent performs preliminary actions by pre-forming the RDL on the carrier substrate with precise conductive traces before the bonding step. Contact pads are also prepared in advance on the semiconductor elements. This preliminary preparation ensures that when bonding occurs, alignment is already established, reducing the complexity of the bonding process itself.
Solution Approach 2:
The carrier substrate acts as an intermediary that holds the pre-formed RDL and facilitates precise alignment during bonding. The carrier provides a stable platform with pre-defined conductive trace patterns, mediating between the RDL formation process and the final assembly, thereby simplifying the overall manufacturing process while maintaining high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The direct bonding methods ensure precise alignment and reduce misalignment, enabling high-density interconnects and efficient signal transfer between integrated device dies, overcoming the limitations of deposited RDLs.
Implementation Method 1
nitrogen or oxygen plasma treatments to enhance bonding
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can include an interconnect structure that has a first side and a second side opposite the first side. The bonded structure can also include a first die that is mounted to the first side of the interconnect structure. The first die can be directly bonded to the interconnect structure without an intervening adhesive. The bonded structure can also include a second die that is mounted to the first side of the interconnect structure. The bonded structure can further include an element that is mounted to the second side of the interconnect structure. The first die and the second die are electrically connected by way of at least the interconnect structure and the element.