Direct-Bonded Microchannel Cooling for High-Power Semiconductor Chips
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Solution Overview
Problem
As semiconductor chips become more integrated, the increasing power density leads to challenges in efficiently dissipating heat without significant thermal resistance, leakage, and stress in conventional cooling systems.
Innovation Solution
A semiconductor package liquid cooling system with a microchannel structure and manifold directly bonded to the chip, utilizing methods like fusion bonding and anodic bonding to minimize thermal resistance, and incorporating features such as microchannels with high aspect ratios, multiple zones for flow control, and impurity doping to enhance thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional cooling systems are used with highly integrated semiconductor chips, then the chip can operate with high power density, but significant thermal resistance prevents efficient heat dissipation
Solution Approach 1:
The cooling apparatus is segmented into multiple zones with independently controllable flow rates, allowing optimized cooling for different heat generation regions on the chip. This segmentation enables precise thermal management by matching cooling capacity to local heat dissipation requirements.
Solution Approach 2:
The patent transitions from conventional two-dimensional cooling to three-dimensional microchannel structures with high aspect ratios, adding vertical dimensionality to heat dissipation. This dimensional change significantly increases the cooling surface area and improves thermal conductivity between the chip and cooling apparatus.
2Reliability
If bonding methods are used to attach cooling apparatus to chip, then thermal contact is improved, but stress and leakage risks increase
Solution Approach 1:
The patent employs anodic bonding, a process that fundamentally changes the physical and chemical parameters of the bonding interface through electrochemical reactions. This creates a strong, hermetic bond with excellent thermal contact while minimizing stress, as the bonding process forms a direct metallurgical or ceramic-to-ceramic connection rather than relying on mechanical adhesives.
3Reliability
If microchannels with high aspect ratios are used, then thermal conductivity and flow control are enhanced, but manufacturing complexity increases
Solution Approach 1:
The cooling apparatus features microchannels with locally optimized high aspect ratios in critical heat dissipation zones, while other regions use standard channel dimensions. This local quality approach maximizes thermal conductivity where needed without unnecessarily complicating the entire manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces thermal resistance, minimizes leakage, and optimizes heat dissipation by enhancing the flow rate and thermal conductivity, thereby improving cooling efficiency and reducing operational costs.
Implementation Method 1
The microchannel structure may be directly bonded to a chip and dissipate heat generated in the chip
Implementation Method 2
utilizing methods like fusion bonding and anodic bonding to minimize thermal resistance
Implementation Method 3
utilizing methods like fusion bonding and anodic bonding to minimize thermal resistance
Implementation Method 4
doping one or more impurity elements into a base of a cooling apparatus, or a chip, or both
Data Source
AI summary
A semiconductor device includes a chip and a cooling apparatus dissipating heat generated in the chip during an operation of the chip, the cooling apparatus including a base, a plurality of microchannels, and a manifold disposed over the plurality of microchannels. A method of fabricating the semiconductor device includes increasing a thermal conductivity of the base of the cooling apparatus, or a thermal conductivity of the chip, or both, and directly bonding the cooling apparatus to the chip.