Direct-Bonded Cooling Channels for Multi-Die Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in delivering cooling fluids effectively between multiple substrates or dies due to thermal resistance and limited channel configurations, making it difficult to manage heat extraction efficiently.
Innovation Solution
The implementation of channels extending across or between multiple components of semiconductor devices, utilizing direct bonding interfaces and zero-clearance bonding to create sealed pathways for fluid flow between substrates and dies, allowing for customized heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If channels are placed near active regions to minimize thermal resistance, then cooling efficiency is improved, but it becomes difficult to deliver cooling fluid between multiple substrates or dies
Solution Approach 1:
The patent divides the cooling system into multiple independent channels, with each channel dedicated to cooling specific substrates or dies. This segmentation allows the cooling fluid to be delivered to multiple components through separate pathways, reducing the complexity of fluid delivery while maintaining effective thermal coupling at each active region.
Solution Approach 2:
The patent introduces an intermediary substrate or interposer that contains channels and serves as a mediator to deliver cooling fluid between multiple substrates or dies. This intermediary component simplifies the overall fluid delivery system by providing a centralized channel structure that can serve multiple heat-generating components simultaneously.
2Temperature
If channels extend across multiple components for heat extraction, then cooling coverage is improved, but fluid leakage risk increases
Solution Approach 1:
The patent employs thin film barriers or seals within the channel structure that extend across multiple substrates or dies. These thin film seals prevent fluid leakage while allowing the channels to maintain thermal coupling with multiple heat-generating components, thus preserving heat dissipation efficiency while improving fluid sealing reliability.
Solution Approach 2:
The patent uses composite structures combining different materials with complementary properties - such as thermally conductive materials for heat extraction and fluid-impermeable materials for sealing - to create channels that can simultaneously achieve effective heat dissipation across multiple components and prevent fluid leakage.
3Manufacturing precision
If direct bonding interfaces are used to create sealed pathways, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple bonding interfaces and sealing functions into a single integrated structure or process step. By merging the channel formation, sealing, and bonding operations into one unified approach, the patent reduces assembly complexity while maintaining the high manufacturing precision required for effective thermal and fluid coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation by enabling efficient fluid delivery to active regions, minimizing thermal resistance, and preventing fluid leakage, thus improving the cooling efficiency of semiconductor packages.
Implementation Method 1
minimize the thermal resistance between heat source and the cooling fluid and provide cooling to the one or more active regions
Implementation Method 2
utilizing direct bonding interfaces and zero-clearance bonding to create sealed pathways for fluid flow between substrates and dies
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including a substrate comprising a first channel, a first die coupled to the first substrate and comprising at least a first portion of a second channel, and a first opening extending from the first channel to the second channel.