Direct-Bonded Optical Elements for Precise LED Chip Assembly
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Solution Overview
Problem
The individual assembly of optical elements on radiation-emitting semiconductor chips is expensive, time-consuming, and complex, especially when high positioning accuracy is required.
Innovation Solution
A radiation-emitting semiconductor device with a semiconductor body, a carrier, and an optical element, where the optical element is attached to the semiconductor body using a direct bonding connection, allowing for efficient and accurate production of multiple devices simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If optical elements are individually assembled on radiation-emitting semiconductor chips, then positioning accuracy can be achieved, but production cost and time increase significantly
Solution Approach 1:
The patent merges the semiconductor chip and optical element into a single integrated component during the epitaxial growth process. The optical element is formed directly on the semiconductor substrate in the same manufacturing process, eliminating separate assembly steps while maintaining precise positioning through controlled deposition patterns.
Solution Approach 2:
The optical element is prepared and positioned on the semiconductor substrate during the epitaxial growth process itself, before final device completion. This preliminary integration ensures precise positioning is built into the structure from the outset, avoiding later assembly complications.
2Manufacturing precision
If optical elements are individually assembled on radiation-emitting semiconductor chips, then positioning accuracy can be achieved, but production complexity increases
Solution Approach 1:
The patent combines the semiconductor chip fabrication and optical element assembly into a single integrated process. The optical element is grown epitaxially on the semiconductor substrate, merging two previously separate manufacturing streams into one unified process that reduces overall complexity.
Solution Approach 2:
The epitaxial growth process automatically positions and integrates the optical element with the semiconductor chip through self-aligned deposition. The process inherently provides the necessary positioning accuracy without requiring complex external alignment equipment or manual assembly procedures.
3Ease of manufacture
If joining layers are used to attach optical elements, then attachment is simplified, but absorption losses increase
Solution Approach 1:
The patent removes the joining layer from the optical path entirely. By forming the optical element directly on the semiconductor substrate through epitaxial growth, the interface between optical element and substrate eliminates the need for adhesive or solder layers that would cause absorption losses.
Solution Approach 2:
The semiconductor substrate itself serves as the bonding interface between the optical element and the device structure. This direct epitaxial bond provides mechanical attachment without requiring separate joining materials, thereby eliminating the absorption losses that would occur in adhesive or solder layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The direct bonding connection enables high-reliability attachment of optical elements with sub-micrometer accuracy, reducing production costs and time while maintaining excellent radiation properties.
Implementation Method 1
The optical element is intended in particular to shape, for example to focus, collimate or expand the radiation emitted from the active region
Implementation Method 2
The optical element is intended in particular to shape, for example to focus, collimate or expand the radiation emitted from the active region
Implementation Method 3
the connecting partners to be connected to one another, which are in particular prefabricated, are held together by atomic and/or molecular forces, in particular by means of hydrogen bonds and/or Van der Waals interactions
Implementation Method 4
the connecting partners to be connected to one another, which are in particular prefabricated, are held together by atomic and/or molecular forces, in particular by means of hydrogen bonds and/or Van der Waals interactions
Implementation Method 5
the active region is intended to generate electromagnetic radiation in the ultraviolet, visible or infrared spectral range
Implementation Method 6
the active region is intended to generate electromagnetic radiation in the ultraviolet, visible or infrared spectral range
Data Source
AI summary
A radiation-emitting semiconductor device (1) is specified, comprising a semiconductor body (2) having an active region (20) provided for generating radiation, a carrier (3) on which the semiconductor body is arranged and an optical element (4), wherein the optical element is attached to the semiconductor body by a direct bonding connection.Furthermore, a method for producing of radiation-emitting semiconductor devices is specified.