Direct Cable Power Delivery for ASIC Packages Beyond PCB Vias
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Solution Overview
Problem
Conventional power delivery systems for ASICs face inefficiencies due to IR drop, resistance, and parasitic inductance through vias and planes in PCBs, leading to space constraints, thermal stress, and increased layer counts, which hinder effective power transfer and thermal management.
Innovation Solution
A power delivery system that bypasses PCB power planes and vias by using cables with a connecting member to directly deliver power from a POL module to the ASIC package, reducing resistance and thermal coupling, and allowing for simplified rework and reduced PCB layer counts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power is delivered through PCB vias and planes, then power can be transferred to ASIC, but IR drop and parasitic inductance increase reducing efficiency
Solution Approach 1:
The patent extracts the power delivery path from the PCB internal structure (vias and planes) and relocates it to external cables and connecting members. This separation removes the harmful IR drop and parasitic inductance from the critical power delivery path, allowing efficient power transfer while maintaining PCB integrity for other functions.
Solution Approach 2:
The patent introduces cables and connecting members as intermediary components between the power source and ASIC. These intermediaries provide a low-resistance, low-inductance path for power delivery, replacing the inadequate PCB internal pathways and enabling efficient high-current power transfer.
2Power
If PCB layer count is increased to accommodate power delivery, then power can be delivered, but device complexity and space requirements increase
Solution Approach 1:
The patent extracts the power delivery function from the PCB layer structure and implements it externally using cables and connecting members. This eliminates the need for multiple PCB layers dedicated to power delivery, reducing PCB complexity while maintaining adequate power delivery capability.
3Power
If conventional PCB power delivery is used, then power can be transferred, but thermal stress and heat generation increase
Solution Approach 1:
The patent extracts the high-current power delivery path from the PCB thermal environment and routes it through external cables and connecting members. This separation removes the thermal coupling between power delivery paths and sensitive PCB components, reducing thermal stress and heat generation in the PCB while maintaining effective power transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a 3:1 improvement in power delivery efficiency and reduced thermal stress, enabling higher current handling with less heat generation and space savings on the PCB, while maintaining compatibility with existing cooling solutions.
Implementation Method 1
a cable having a first end attached to the connecting member and a second end configured for electrically coupling with a power supply component
Data Source
AI summary
In one embodiment, an apparatus includes a connecting member configured for positioning on an upper surface of an integrated circuit package and a cable comprising a first end attached to the connecting member and a second end configured for electrically coupling with a power supply component. The connecting member is operable to position the cable for connection to the upper surface of the integrated circuit package to deliver power from the power supply component to the integrated circuit package with the power supply component and the integrated circuit package mounted on an upper surface of a printed circuit board. A method is also disclosed herein.