Direct Cable Termination on IC Substrate for Signal Integrity

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Solution Overview

Problem

Data communication systems face challenges in maintaining high data transfer speeds while ensuring signal integrity, particularly due to signal degradation across separable interfaces in conventional electrical connector systems.

Innovation Solution

The electrical component features a multilayer package substrate with integrated circuits, where electrical signal traces and grounds are directly connected to the substrate without separable interfaces, allowing electrical cables to be mounted directly to the substrate, eliminating the need for separable connectors and thus preventing signal degradation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If separable electrical connectors are used to connect electrical cables to integrated circuits, then ease of assembly and disassembly is improved, but signal integrity deteriorates due to signal degradation at separable interfaces

Engineering Contradiction:
Improveease of assemblyVSAvoidsignal integrity
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent merges the electrical cable termination directly with the integrated circuit package substrate by eliminating the separable connector interface. The electrical cable is bonded directly to contact pads on the substrate, creating a unified structure that removes the separable interface responsible for signal degradation, thereby maintaining signal integrity while still allowing for assembly and disassembly at the cable-substrate level.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If electrical cables are directly connected to integrated circuits without separable connectors, then signal integrity is improved by eliminating separable interfaces, but device complexity increases

Engineering Contradiction:
Improvesignal integrityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the separable connector component from the electrical connection system, eliminating it entirely. By removing this intermediate component and directly bonding the electrical cable to the integrated circuit package substrate, the design simplifies the overall structure while improving signal integrity. The complexity is reduced by having fewer components and interfaces to manage.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS11576260B2Method and apparatus for terminating an electrical cable to an integrated circuit
Publication Date: 2023.02.07 SAMTEC INC
  • US11576260B2 patent drawing
  • US11576260B2 patent drawing
  • US11576260B2 patent drawing

AI summary

An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.