Direct-Contact Cooling Module With Microjets for Processor Heat
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Solution Overview
Problem
Current cooling solutions for electronic components, such as metal heat sinks, rely on thermal paste and are inefficient in keeping pace with processor power advancements, leading to reduced performance and potential device failure over time.
Innovation Solution
A direct-contact single-phase fluid-based cooling module that uses a manifold with a fluid plenum and nozzle plate to deliver coolant directly to the electronic component, eliminating the need for thermal paste and providing high-performance cooling in a compact package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional metal heat sinks with thermal paste are used, then thermal contact is established, but thermal performance is insufficient for high power density processors and thermal paste degrades over time
Solution Approach 1:
The patent removes thermal paste from the system entirely, replacing it with a direct liquid cooling interface where coolant flows through channels in direct contact with the processor surface, eliminating the thermal interface material that degrades over time
Solution Approach 2:
The invention uses liquid coolant flowing through integrated cooling channels to transfer heat directly from the processor, replacing the solid thermal paste interface with a fluid-based thermal management system that provides superior and durable thermal contact
2Loss of energy
If large metal heat sinks are used to dissipate heat, then thermal dissipation capacity increases, but size and weight increase causing mechanical stress on processor package and circuit board
Solution Approach 1:
The cooling channels are integrated directly into the processor package structure, merging the heat dissipation function with the processor housing itself, eliminating the need for separate large external heat sinks
Solution Approach 2:
The cooling system is divided into distributed channels within the processor package that collectively handle heat dissipation, allowing heat to be removed at multiple locations close to heat sources rather than requiring a single large external heat sink
3Loss of energy
If large heat sinks are used for cooling, then heat dissipation improves, but packing density of processors in data centers is limited
Solution Approach 1:
The cooling functionality is merged into the processor package itself through integrated channels, eliminating the need for additional external heat sink volume and enabling higher processor packing density in data centers
4Ease of manufacture
If thermal paste is used to attach heat sinks, then thermal connection is established, but the assembly effectiveness depends on thermal paste durability which degrades over time
Solution Approach 1:
The patent eliminates thermal paste from the assembly, using direct liquid cooling channels that contact the processor surface without requiring any thermal interface material, thereby removing the reliability issue of thermal paste degradation
Solution Approach 2:
The system uses flowing liquid coolant to maintain thermal contact with the processor surface, replacing the static thermal paste interface with a dynamic fluid interface that self-renewes and does not degrade over time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high thermal performance, reduces mechanical stress on the processor, and allows for greater modularity, enabling efficient cooling of electronic components without the limitations of traditional heat sink solutions.
Implementation Method 1
when a fluid is passed through the manifold the fluid directly contacts the electronic component
Implementation Method 2
a direct-contact single-phase fluid-based cooling module for fluidly cooling an electronic component
Data Source
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AI summary
A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards, he fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.