Direct-Contact PCB Cooling Conduit for High-Temperature Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electrical components in turbochargers, particularly those actuated by electric motors, are challenged by high-temperature environments, necessitating effective cooling solutions that do not increase cost or complexity.
Innovation Solution
A cooling fluid conduit system is integrated with a printed circuit board (PCB) to directly contact electrical components, utilizing a heat sink and a cooling fluid conduit that extends adjacent to or between PCBs, providing thermal contact and cooling fluid circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electrical components are kept nearby the turbocharger, then control complexity is reduced, but the electrical components are exposed to high temperatures
Solution Approach 1:
The patent segments the cooling solution by introducing a dedicated cooling fluid conduit system that selectively directs cooling fluid to specific electrical components based on their thermal requirements. This allows the electrical components to remain integrated with the turbocharger control system while receiving targeted thermal management.
Solution Approach 2:
The cooling fluid conduit acts as an intermediary between the cooling fluid source and the electrical components. It transfers thermal energy away from the electrical components without requiring physical separation or complex thermal barrier structures, enabling close proximity placement while maintaining acceptable operating temperatures.
2Temperature
If a cooling system is added to protect electrical components, then temperature control is improved, but cost and complexity increase
Solution Approach 1:
The cooling fluid conduit system is designed to serve multiple electrical components simultaneously through a single integrated network. The conduit can be configured to cool multiple components with different thermal requirements using a unified cooling architecture, reducing overall system complexity compared to individual cooling solutions for each component.
Solution Approach 2:
The patent utilizes parameter changes in the cooling fluid (temperature, flow rate) to adapt to different thermal loads of various electrical components. By adjusting cooling parameters rather than changing the physical configuration, the system achieves effective temperature control without increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools electrical components by directly contacting them with cooling fluid, maintaining their functionality in high-temperature environments without increasing cost or complexity.
Implementation Method 1
a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components
Implementation Method 2
a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB
Data Source
AI summary
An electronics assembly used in a vehicle included a printed circuit board (PCB) having a first side and a second side; a plurality of electrical components mounted on the first side of the PCB; a heat sink, configured to receive cooling fluid from a source, positioned adjacent to the second side of the PCB; and a cooling fluid conduit, configured to communicate the cooling fluid from a fluid inlet to a fluid outlet, wherein the cooling fluid conduit is positioned adjacent to the first side of the PCB and directly contacts an outer surface of the electrical components.