Direct-Contact Processor Cooling Module Without Thermal Paste
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Solution Overview
Problem
Current cooling methods for electronic components, such as processors, are inadequate due to their reliance on large, heavy metal heat sinks and thermal pastes, which limit packing density and performance, and degrade over time, leading to reduced effectiveness.
Innovation Solution
A direct-contact single-phase fluid-based cooling module with a manifold that forms a fluid-tight seal with the processor, eliminating the need for thermal paste and using microjet cooling to enhance heat transfer, where the module is mounted to the printed circuit board rather than the processor, allowing for compact, high-performance cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large metal heat sinks are used to cool processors, then heat dissipation performance is improved, but device size and weight increase
Solution Approach 1:
The patent replaces traditional metal heat sinks with a liquid cooling system that uses fluid circulation through channels formed directly in the processor package. The liquid coolant absorbs heat through convection and phase change, achieving superior heat dissipation without the weight penalty of large metal heat sinks.
Solution Approach 2:
The patent changes the thermal management approach from solid conduction through metal heat sinks to liquid convection and phase change within the processor package. This parameter change enables higher heat flux removal efficiency while reducing the mass of cooling components.
2Temperature
If thermal paste is used to attach heat sinks to processors, then thermal contact is improved, but reliability decreases over time due to paste degradation
Solution Approach 1:
The patent eliminates thermal paste entirely by forming fluid circulation channels directly within the processor package substrate. The liquid coolant makes direct contact with heat-generating components through these integrated channels, removing the unreliable thermal paste interface layer.
Solution Approach 2:
The patent uses the processor package substrate itself as the intermediary for heat transfer, with fluid channels embedded within it. This eliminates the need for external thermal paste while providing reliable, direct thermal coupling between the processor and coolant.
3Temperature
If large heat sinks are used for cooling, then heat dissipation is improved, but packing density of processors decreases
Solution Approach 1:
The patent nests fluid circulation channels directly within the processor package substrate, integrating the cooling function into the package structure itself. This eliminates the need for external heat sinks and allows for much tighter processor packing densities.
Solution Approach 2:
The patent moves thermal management from a two-dimensional external heat sink attachment to a three-dimensional integrated fluid channel system within the package. This enables heat dissipation without increasing the footprint area.
4Strength
If mechanical fastening is used to attach cooling components to processors, then attachment strength is improved, but mechanical stress on the processor increases
Solution Approach 1:
The patent merges the cooling function with the processor package structure by integrating fluid channels directly into the substrate. This eliminates separate cooling components that would require mechanical fastening, thereby removing the source of mechanical stress on the processor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides high thermal performance without the need for thermal pastes or additional metal heat spreaders, achieving heat transfer coefficients exceeding 200,000 W/m2K, while minimizing mechanical stress on the processor and allowing for greater packing density and modularity.
Implementation Method 1
direct contact is established between the fluid and the electronic component... achieving heat transfer coefficients exceeding 200,000 W/m2K
Implementation Method 2
single-phase fluid-based cooling module... fluid passes from the inlet, within the electronic component, and to the outlet, for purposes of better heat transfer
Data Source
AI summary
A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.