Direct-Cooled Power Module With Porous Bonding for Shorter Heat Paths
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Solution Overview
Problem
Conventional power modules suffer from low cooling efficiency due to a long heat transfer path and require additional structures like spacers, increasing manufacturing costs and reducing thermal efficiency.
Innovation Solution
A direct cooling type power module design where an insulating fluid is in direct contact with the power semiconductor device, utilizing a bonding unit with porous and thermally conductive layers to enhance heat exchange, reducing the number of parts and simplifying the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If indirect cooling method is used with cooling channels contacting top and bottom surfaces, then cooling structure is established, but cooling efficiency is low due to long heat transfer path
Solution Approach 1:
The patent extracts and eliminates the intermediate substrate layer that causes long heat transfer path. By directly bonding the power semiconductor device to the cooling plate, the cooling channels are brought into direct contact with the device, removing the unnecessary thermal resistance layer and significantly shortening the heat transfer path.
Solution Approach 2:
The patent employs asymmetric bonding where the power semiconductor device is bonded only to the cooling plate (one-sided bonding), rather than symmetrically bonding to both top and bottom substrates. This asymmetric configuration optimizes the heat transfer path by directly connecting the heat source to the cooling medium without requiring contact with both substrates.
2Ease of operation
If spacer structure is added for electrical connection, then wire installation space is provided, but heat transfer efficiency is lowered and manufacturing costs increase
Solution Approach 1:
The patent merges the cooling function and electrical connection function into a single integrated structure. The cooling plate serves both as the thermal management component and as the electrical connection substrate, eliminating the need for separate spacers and wire installation spaces while maintaining both cooling efficiency and electrical connectivity.
Solution Approach 2:
The cooling plate is designed to perform multiple functions simultaneously: it acts as a thermal conduction path for cooling, provides mechanical support, and serves as the electrical connection substrate. This multi-functional design eliminates the need for separate spacer components and reduces manufacturing complexity.
3Ease of operation
If spacer structure is added between power semiconductor device and substrate, then electrical connection is enabled, but manufacturing costs increase
Solution Approach 1:
The patent combines the substrate and cooling plate into a single integrated component. The cooling plate itself provides the electrical connection function previously requiring a separate spacer, thereby reducing the number of parts, simplifying assembly, and lowering manufacturing costs while maintaining electrical connectivity.
4Reliability
If direct cooling method is used with insulating fluid in direct contact, then cooling efficiency is improved, but insulation requirement increases
Solution Approach 1:
The patent employs a porous coating layer on the cooling plate surface that allows thermal conduction while providing electrical insulation. The porous structure enables heat transfer through the material matrix while the material composition (such as ceramic or polymer) provides the necessary electrical insulation to prevent short circuits between the cooling fluid and electrical components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves cooling efficiency, reduces manufacturing costs, and enhances reliability by minimizing thermal expansion coefficient differences, while maintaining structural integrity and stability.
Implementation Method 1
a bonding unit including a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulating fluid by the porous layer and the thermally conductive layer
Implementation Method 2
an enclosure filled with an insulating fluid; a power semiconductor device disposed inside the enclosure
Data Source
AI summary
A direct cooling type power module comprising, an enclosure filled with an insulating fluid, a power semiconductor device disposed inside the enclosure and a bonding unit comprising a porous layer, and a thermally conductive layer to which the power semiconductor device is bonded, and allowing the power semiconductor device to exchange heat with the insulating fluid by the porous layer and the thermally conductive layer.