Direct-Cooled Power Module Package With Nested Heat Sink Slots
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Solution Overview
Problem
Conventional power module packages are often large due to cooling performance requirements, necessitating a more compact and efficient design for direct cooling of multiple power modules.
Innovation Solution
A power module package comprising a plurality of power modules, heat sinks, a module carrier, and a housing, where the module carrier includes regions defining heat-sink slots and positioning guides for precise alignment, with a ring member for sealing and direct cooling by injecting a cooling fluid into a chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional power module packages use traditional cooling methods, then cooling performance requirements are met, but the package size becomes large
Solution Approach 1:
The patent implements nesting by placing heat sinks inside the housing cavity, with heat sink slots defined within the housing structure. Multiple heat sinks are arranged in a compact configuration within the available space, allowing the cooling components to be nested within the package rather than extending outward, thereby reducing overall package volume while maintaining effective heat dissipation
Solution Approach 2:
The patent utilizes vertical stacking and three-dimensional arrangement of power modules and heat sinks. Heat sinks extend in multiple directions (first direction for heat dissipation, second direction for structural support) creating a compact 3D configuration that maximizes cooling surface area within a reduced footprint, transitioning from traditional horizontal expansion to vertical and spatial optimization
2Volume of moving object
If multiple power modules are integrated into a single package, then space efficiency is improved, but assembly complexity increases
Solution Approach 1:
The patent divides the package into distinct functional regions: a housing containing heat sink slots, a module carrier with positioning guides, and separate mounting areas for power modules and heat sinks. This segmentation allows each component to be manufactured and prepared independently, then assembled in a systematic sequence, reducing overall assembly complexity despite integrating multiple modules
Solution Approach 2:
The patent incorporates preliminary action through pre-defined heat sink slots in the housing and positioning guides on the module carrier. These features are prepared in advance during housing and carrier manufacturing, establishing precise alignment references before power modules and heat sinks are installed. This preliminary structuring simplifies the actual assembly process by eliminating the need for complex alignment procedures during assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for compact, robust, and easy assembly of power modules with direct cooling, reducing heat generation and enabling efficient heat dissipation through direct contact with cooling fluid, suitable for high-voltage applications.
Implementation Method 1
heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module
Implementation Method 2
direct cooling by injecting a cooling fluid into a chamber
Data Source
AI summary
According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.