Signal Integrity via Direct Copper Pad Contact

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Solution Overview

Problem

High-frequency electronic signal transmission requires increased bandwidth and accuracy, with existing technologies struggling to maintain signal integrity and speed due to rapid data interactions measured in nanoseconds.

Innovation Solution

An electronic signal processing device comprising a printed circuit board, signal processing chip, conductive lines, copper pads, and a fixing device that allows direct contact between electrical contacts of a cable assembly and copper pads, reducing connection components and improving signal integrity by varying the width of electrical contacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional connection components are used between the circuit board and cable assembly, then the connection is more robust, but the signal integrity deteriorates due to additional connection interfaces and signal attenuation

Engineering Contradiction:

Improvesignal integrityVSAvoidconnection components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the connection between the circuit board and cable assembly by allowing electrical contacts to directly contact copper pads without intermediate connectors. This eliminates additional connection interfaces and reduces signal attenuation, thereby improving signal integrity while reducing device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates unnecessary intermediate connection components from the signal transmission path. By removing these components, the signal can travel directly from the signal processing chip through conductive lines to copper pads and then directly to electrical contacts, reducing signal attenuation and improving signal integrity.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If the width of electrical contacts is uniform, then the manufacturing is simpler, but the signal integrity deteriorates at high frequencies

Engineering Contradiction:

Improvesignal integrityVSAvoidelectrical contact width consistency

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies local quality by varying the width of electrical contacts at different positions. The electrical contacts have different widths in different regions to optimize signal integrity at high frequencies, with wider sections for better signal transmission and narrower sections for impedance matching, rather than using a uniform width throughout.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the geometric parameter (width) of electrical contacts to optimize signal integrity. By adjusting the width parameter of electrical contacts at different positions, the patent achieves better high-frequency signal transmission characteristics while maintaining manufacturability.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If data transmission rate is increased to meet bandwidth requirements, then the information transmission capability is improved, but the signal accuracy deteriorates due to nanosecond-level interaction times

Engineering Contradiction:

Improvedata transmission rateVSAvoidsignal accuracy

Core Design Contradiction:

ProductivityVSMeasurement precision

Solution Approach 1:

The patent ensures continuous and direct signal transmission from the signal processing chip through conductive lines to copper pads and then directly to electrical contacts without interruption or additional connection interfaces. This continuous transmission path minimizes signal degradation and maintains signal accuracy even at nanosecond-level interaction times required for high data transmission rates.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The patent enables the signal to rush through the connection interface by eliminating intermediate connectors and components. The direct contact between copper pads and electrical contacts allows the signal to pass through quickly without delay or degradation, maintaining signal accuracy at extremely high data transmission rates.

Inventive Principle:

Principle #21Skipping (Rushing through)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances signal integrity and increases the quality and speed of high-frequency signal transmission by minimizing signal attenuation and variation, effectively supporting higher data transmission rates.

Implementation Method 1

the conductive lines are formed on the printed circuit board and electrically connected to the signal processing chip

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the electrical contacts of the cable assembly can directly contact the copper pads of the circuit board

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10530078B1Electronic signal processing device

Publication Date: 2020.01.07 BIZLINK INT CORP

AI summary

An electronic signal processing device includes a printed circuit board, a signal processing chip, a plurality of conductive lines, a plurality of copper pads, and a fixing device. The signal processing chip is mounted on the printed circuit board, and a plurality of conductive lines are formed on the printed circuit board and connected to the signal processing chip. The copper pads are respectively formed at the ends of the conductive lines. The fixing device is fixed on the printed circuit board and exposes the copper pads to connect to a cable assembly so as to improve signal integrity.