Direct current power supply device and air conditioner
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Solution Overview
Problem
Conventional direct current power supply devices face issues with short-circuiting via a heat sink, leading to inrush currents, element breakdown, and heat loss, particularly when discrete semiconductors are used without proper electrical insulation from the heat sink.
Innovation Solution
A direct current power supply device design that includes a rectifier circuit, charge storage units with series-connected capacitors, and discrete semiconductor switching elements and diodes, where the elements are thermally coupled to a heat sink but electrically insulated to prevent short-circuiting, utilizing a full mold package diode to prevent excessive current flow during power-on.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If discrete semiconductor elements are cooled by bonding to a heat sink, then heat dissipation performance is improved, but electrical insulation between the semiconductor elements and heat sink becomes critical to prevent short-circuiting
Solution Approach 1:
The patent introduces an insulating member as an intermediary component positioned between the semiconductor elements and the heat sink. This insulating member thermally conducts heat away from the semiconductor elements while electrically insulating them from the heat sink, thereby resolving the contradiction between heat dissipation performance and electrical insulation reliability
Solution Approach 2:
The patent applies different properties to different parts of the system: the insulating member has high thermal conductivity in the direction of heat flow while maintaining electrical insulation properties. This local differentiation of properties allows simultaneous achievement of effective heat dissipation and electrical insulation
2Reliability
If all semiconductor elements use full mold package structure, then electrical insulation and reliability are improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent segments the semiconductor elements into two categories: those requiring full mold packages for electrical insulation (such as elements connected to potential difference detection terminals) and those that can use simpler packaging structures. This segmentation allows selective application of expensive full mold packages only where necessary, reducing overall manufacturing cost while maintaining reliability
Solution Approach 2:
The insulating member serves as a mediator that provides electrical insulation for semiconductor elements that do not require full mold packages. This allows these elements to use cost-effective packaging structures while still achieving the necessary electrical insulation through the insulating member
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents short-circuiting and associated breakdowns and heat losses by ensuring electrical insulation between semiconductor elements and the heat sink, while minimizing the use of costly full mold package elements, thus maintaining efficiency and reducing costs.
Implementation Method 1
The heat sink includes a function of dissipating heat of the positive-side switching element, the negative-side switching element, the positive-side backflow prevention diode, and the negative-side backflow prevention diode
Implementation Method 2
a rectifier circuit that rectifies the alternating current power supplied from the alternating current power supply and converts the alternating current power into the direct current power
Implementation Method 3
a charge storage unit connected to the first output terminal and the second output terminal and including a function of storing a charge; The charge storage unit includes a positive-side capacitor and a negative-side capacitor connected in series
Data Source
AI summary
A direct current power supply device includes a rectifier circuit that rectifies alternating current power supplied from an alternating current power supply and converts the alternating current power into direct current power, a charge storage unit that includes a function of storing a charge, a charger that charges the charge storage unit, and a heat sink. The charger includes a positive-side switching element, a negative-side switching element, a positive-side backflow prevention diode, and a negative-side backflow prevention diode. The positive-side switching element, the negative-side switching element, the positive-side backflow prevention diode, and the negative-side backflow prevention diode are discrete semiconductor elements. The negative-side backflow prevention diode is a full mold package element. The positive-side switching element, the negative-side switching element, and the positive-side backflow prevention diode are elements that are not full mold packages.