Direct Die Transfer via Fluid Actuation for Semiconductor Packaging
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Solution Overview
Problem
Conventional systems for transferring semiconductor device dies from a film to a support structure are inefficient, often requiring robotic pick-and-place machines that are time-consuming and increase manufacturing costs, and reel-to-reel tape systems that only move dies in one dimension.
Innovation Solution
A method and system for directly transferring singulated integrated device dies from a dicing film to a support structure using a die release assembly with fluid actuators and two-dimensional indexing, allowing for precise placement and elimination of intermediate carriers, enabling direct bonding on the dicing film to streamline the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If robotic pick-and-place machines are used to transfer dies individually, then placement precision is improved, but processing time increases and productivity decreases
Solution Approach 1:
The system segments the transfer process by using multiple nozzles arranged in arrays that can be independently controlled. Each nozzle can transfer a die individually, allowing parallel processing of multiple dies simultaneously, thus maintaining precision while increasing overall throughput
Solution Approach 2:
The patent introduces two-dimensional indexing capability that allows the nozzle array to move and position itself in both X and Y directions. This enables the system to access any die location on the wafer and place it at the corresponding location on the substrate, achieving precise placement without requiring slow sequential robotic movements
2Productivity
If reel-to-reel tape machines are used to move dies, then processing speed is improved, but placement capability is limited to one dimension
Solution Approach 1:
The system adds a second dimension of movement capability through the nozzle array's two-dimensional indexing system. While the wafer and substrate can move in one dimension (similar to reel-to-reel), the nozzle array can independently position itself in both X and Y directions, enabling precise two-dimensional placement of dies at any location on the substrate
Solution Approach 2:
The nozzle array serves multiple functions: it can transfer dies in parallel (increasing speed), position dies at any two-dimensional location (providing flexibility), and adapt to different die sizes and patterns (enhancing versatility). This multi-functional design combines the speed of reel-to-reel systems with the precision and flexibility of robotic systems
3Ease of operation
If intermediate carriers are used for die transfer, then handling is simplified, but processing steps increase and time is lost
Solution Approach 1:
The patent extracts and eliminates the intermediate carrier from the transfer process. The nozzle array directly transfers dies from the wafer to the final substrate without requiring an intermediate holding carrier, thereby reducing the number of processing steps and minimizing the time lost in intermediate transfers while maintaining ease of handling through the controlled nozzle array system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces processing time and manufacturing costs by enabling efficient, two-dimensional placement of known good dies directly onto a support structure, minimizing handling and intermediate transfers, and improving the efficiency of direct bonding processes.
Implementation Method 1
a fluid actuator having a plurality of nozzles configured to direct a high velocity fluid against the backside of the film to cause the selected die to transfer from the film to the support structure
Data Source
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AI summary
Systems and methods for efficient transfer of elements are disclosed. A film which supports a plurality of diced integrated device dies can be provided. The plurality of diced integrated device dies can be disposed adjacent one another along a surface of the film. The film can be positioned adjacent the support structure such that the surface of the film faces a support surface of the support structure. The film can be selectively positioned laterally relative to the support structure such that a selected first die is aligned with a first location of the support structure. A force can be applied in a direction nonparallel to the surface of the film to cause the selected first die to be directly transferred from the film to the support structure.