Direct Interconnect Fabric for Data Center Switching

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Solution Overview

Problem

Current data center architectures are inefficient due to the use of multiple levels of Ethernet or LAN switches, which are expensive and slow down message and packet passage, and require different chassis form factors for compute nodes and switches, leading to increased complexity and cost.

Innovation Solution

Implementing a direct interconnect fabric that virtualizes peripherals such as Network Interface cards, Ethernet cards, hard disks, BIOS, and consoles, allowing processors to share these devices and eliminating the need for rack and aggregation switches by performing switching functions within the fabric, thereby flattening the hierarchy and reducing the number of LAN switches.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If multiple levels of Ethernet or LAN switches are used to connect compute nodes and storage nodes, then network connectivity and device access are achieved, but packet and message delays increase and system cost increases

Engineering Contradiction:
Improvepacket and message passage speedVSAvoidnumber of LAN switches
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent extracts the switching function from external Ethernet/LAN switches and relocates it into the interconnect fabric within each chassis. This eliminates the need for separate rack switches and aggregation switches, directly reducing packet delays and the number of network devices while maintaining full connectivity between compute and storage nodes.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the external LAN switching function with the internal interconnect fabric. By combining these previously separate functions into a unified fabric-based switching mechanism, the system eliminates multiple switching layers and reduces both packet delays and the total number of switches required.

Inventive Principle:
Principle #5Merging (Combining)

2Adaptability or versatility

If different chassis form factors are used for compute nodes and switches, then functional separation is achieved, but data center complexity and cost increase

Engineering Contradiction:
Improvefunctional separation capabilityVSAvoidchassis hierarchy
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent makes the interconnect fabric universal by enabling it to perform both internal node communication and external switching functions. This multi-functionality allows a single chassis form factor to accommodate compute nodes, storage nodes, and switching capabilities, eliminating the need for separate specialized chassis for each function.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the switching function from the physical chassis structure. Instead of requiring dedicated switch chassis, the switching capability is segmented as a virtual function within the fabric, allowing any chassis to perform switching operations based on software configuration rather than hardware specialization.

Inventive Principle:
Principle #1Segmentation

3Ease of operation

If rack switches and aggregation switches are deployed in hierarchical levels, then network management and traffic routing are achieved, but packet delays and system cost increase

Engineering Contradiction:
Improvenetwork traffic managementVSAvoidpacket delay
Core Design Contradiction:
Ease of operationVSLoss of time

Solution Approach 1:

The interconnect fabric acts as an intermediary that eliminates the need for intermediate rack switches and aggregation switches. By providing direct fabric-based routing between any compute or storage node, the system removes intermediate switching hops while maintaining centralized management capabilities through software-defined networking.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transitions from a hierarchical switching architecture (multiple vertical levels) to a flattened fabric-based architecture (horizontal peer-to-peer connectivity). This dimensional change allows any node to communicate directly with any other node through the fabric, eliminating the need for traffic to traverse multiple hierarchical levels and reducing packet delays.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS8140719B2Dis-aggregated and distributed data-center architecture using a direct interconnect fabric
Publication Date: 2012.03.20 ADVANCED MICRO DEVICES INC
  • US8140719B2 patent drawing
  • US8140719B2 patent drawing
  • US8140719B2 patent drawing

AI summary

A data center has several dis-aggregated data clusters that connect to the Internet through a firewall and load-balancer. Each dis-aggregated data cluster has several dis-aggregated compute/switch/disk chassis that are connected together by a mesh of Ethernet links. Each dis-aggregated compute/switch/disk chassis has many processing nodes, disk nodes, and I/O nodes on node cards that are inserted into the chassis. These node cards are connected together by a direct interconnect fabric. Using the direct interconnect fabric, remote I/O and disk nodes appear to the operating system to be located on the local processor's own peripheral bus. A virtual Ethernet controller and a virtual generic peripheral act as virtual endpoints for the local processor's peripheral bus. I/O and disk node peripherals are virtualized by hardware without software drivers. Rack and aggregation Ethernet switches are eliminated using the direct interconnect fabric, which provides a flatter, dis-aggregated hierarchy.