Direct Liquid Cooling System for Electronic Components
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Solution Overview
Problem
Current cooling methods for electronic components, particularly in data centers, are costly, energy-inefficient, and inadequate for managing increasing heat densities, leading to reduced system reliability and high operational costs due to the limitations of air-cooling systems and previous liquid-cooling approaches.
Innovation Solution
A direct liquid cooling system featuring a reservoir with a rack configuration for secure electronic component placement, utilizing parallel flows of dielectric coolant facilitated by nozzles and a pump assembly, along with a heat exchanger module and system controller to maintain a thermostable environment, allowing for efficient heat transfer and reduced coolant usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-cooled systems with high airflow rates are used to cool high power components, then cooling effectiveness is improved, but cost and noise impact increase due to powerful high speed fans
Solution Approach 1:
The patent transitions from air-cooling to liquid-cooling by circulating dielectric coolant through cold plates in direct contact with electronic components. This hydraulic cooling method achieves superior heat removal efficiency without requiring high-speed fans, thereby eliminating the noise problem while maintaining effective cooling of high power components
2Temperature
If air cooling solutions are used to cool electronic components, then cooling is provided, but dust accumulation increases leading to static electricity problems
Solution Approach 1:
By replacing air cooling with liquid coolant circulation through cold plates, the system eliminates the need for high-velocity air flow that stirs up dust. The liquid coolant provides cooling through direct thermal contact without moving air, thereby preventing dust accumulation and associated static electricity problems
3Productivity
If the number of electronic components is increased within limited space, then system capability is improved, but heat density increases creating challenging heat related issues
Solution Approach 1:
The liquid cooling system with cold plates provides high-density heat removal capability that scales with component density. The coolant circulation system can efficiently transfer heat from increasingly dense component arrangements, enabling higher system capability within limited space without proportionally increasing cooling challenges
4Temperature
If pure air-cooled systems are used with traditional air-cooled heat sinks, then cooling is provided, but cost increases due to very high airflow rates and large heat sinks
Solution Approach 1:
The patent implements liquid cooling through cold plates that provide efficient heat transfer with lower cost implications. The system uses a closed-loop dielectric coolant circulation system with pumps and heat exchangers, replacing expensive large-scale air cooling infrastructure with a more cost-effective liquid cooling approach that achieves the same or better cooling performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a cost-effective, energy-efficient cooling method that extends beyond traditional systems, enhancing reliability and scalability by maintaining a predetermined temperature environment for electronic components, thereby reducing operational costs and improving heat management.
Implementation Method 1
allowing for parallel flows of dielectric coolant between the electronic components thereby facilitating cooling of the components
Implementation Method 2
A pump assembly coupled with the at least one nozzle through an inlet pipeline that facilitates continuous pumping of the dielectric coolant thereby forcing the dielectric coolant upwards through the electronic components
Implementation Method 3
The system also has a heat exchanger module coupled with the reservoir through an outlet pipeline
Implementation Method 4
The coolant is configured to flow upward in parallel streams between the electronic components through at least one nozzle positioned at a bottom portion of the reservoir
Data Source
AI summary
The present disclosure is directed to a direct liquid cooling system for cooling of electronic components and configured to maintain a predetermined thermostable environment for the electronic components. The system includes a reservoir and a rack removably placed in the reservoir and securely containing electronic components to be cooled. The system also includes a dielectric coolant which is configured to flow upward in parallel streams between the electronic components and a pump that facilitates continuous pumping of the dielectric coolant thereby forcing the dielectric coolant upwards through the electronic components and overflowing the dielectric coolant within the reservoir. A heat exchanger is also provided and coupled with the reservoir via an outlet pipeline. Additionally, a controller is provided to monitor the temperature of the dielectric coolant and adjust the flow of the coolant.