Direct-Mounted LED Chip Light Source Module for Uniform Illumination
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Solution Overview
Problem
Conventional LED lamp modules have significant spacing between LED packages, limiting their density and resulting in a larger size and non-uniform light output due to the inability to be arranged closely, leading to wasted space and increased costs.
Innovation Solution
Directly mounting blue LED chips on a substrate with wavelength converting layers, such as red and green phosphors, to convert blue light into red and green light, allowing for closer proximity and uniform light output, with optional optical reflective or absorptive layers to prevent light interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If LED packages are used with conventional mounting methods, then the LED packages can be easily manufactured and assembled, but significant spacing between LED packages results in limited density and larger module size
Solution Approach 1:
The invention divides the traditional packaged LED into separate components: the LED chip is separated from its package, allowing the chip to be mounted directly on the substrate without the bulky package structure. This segmentation enables precise placement of small LED chips while minimizing the overall module volume.
Solution Approach 2:
The invention transitions from three-dimensional packaged LED structures to a two-dimensional direct chip mounting approach on the substrate. By eliminating the vertical height of packages and using planar wavelength converting layers, the design achieves closer spacing in the horizontal dimension while reducing overall module footprint.
2Ease of manufacture
If LED packages are placed with significant spacing, then manufacturing and assembly are simplified, but the light output becomes non-uniform and space is wasted
Solution Approach 1:
The invention applies different materials with specific properties to different locations: wavelength converting layers (phosphors) are placed locally over specific LED chips to convert their light output. This local application of functional materials enables uniform overall light output while maintaining close spacing between chips, as each chip's light is converted to achieve consistent color and intensity distribution.
3Illumination intensity
If more LED packages are placed in a fixed area, then the light output uniformity improves, but the spacing between packages increases making precise placement difficult
Solution Approach 1:
The invention uses wavelength converting layers as optical copies or transformers of the LED chip output. Instead of requiring precise placement of multiple packaged LEDs to achieve uniformity, the system uses standardized LED chips with wavelength converting materials that optically transform the light to achieve uniform output, reducing the demand for extreme placement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes the size of the light source module and achieves uniform light output by allowing for precise placement of LED chips, reducing the size and cost while enhancing light distribution.
Implementation Method 1
a first wavelength converting layer that covers the blue LED chip of the first illumination element. Blue light emitted from the blue LED chip of the first illumination element is converted to light in the range of a first wavelength by the first wavelength converting layer.
Data Source
AI summary
A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.