Direct-to-Object Printing on Non-Planar Surfaces
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Solution Overview
Problem
Current systems face challenges in forming electrical circuits on non-planar surfaces and accurately installing electronic components, as they require separate processes and are inefficient, especially when applied to objects like pipes.
Innovation Solution
A direct-to-object printing system that includes a printer and an electronic component placement system, allowing for the formation of electrical circuits on non-planar substrates and the precise installation of electronic components using a multi-nozzle extruder and actuators for three-dimensional object manipulation, along with a controller for synchronized operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electrical circuits are formed on flexible substrates in a planar state and then mounted to non-planar objects with adhesive, then the circuits can be formed with precise alignment, but the production time increases and the process becomes inefficient
Solution Approach 1:
The patent combines two separate processes (circuit formation on planar substrate and mounting to non-planar object) into a single integrated process. The direct-to-object printer forms electrical circuits directly on the non-planar object surface, eliminating the need for separate substrate preparation and adhesive mounting steps, thereby reducing production time while maintaining precision through controlled material deposition
Solution Approach 2:
The patent segments the printing process into multiple passes or stages, allowing the circuit to be formed incrementally on the non-planar surface. The multi-nozzle extruder system can deposit different materials (conductive traces, adhesive, components) in sequence, enabling precise alignment to be achieved through staged deposition rather than requiring the entire circuit to be formed and then mounted as a single unit
2Adaptability or versatility
If electronic components are placed on non-planar surfaces, then the circuits can be directly applied to objects like pipes, but achieving precise alignment becomes significantly more difficult
Solution Approach 1:
The patent employs a multi-nozzle extruder system with multiple degrees of freedom that can dynamically adjust its position and orientation to match the non-planar surface geometry. The system includes actuators that enable real-time adjustment of the extruder head position and angle, allowing precise material deposition and component placement to follow complex three-dimensional surfaces while maintaining alignment accuracy
Solution Approach 2:
The patent replaces traditional mechanical component placement methods (which rely on rigid fixtures and planar surfaces) with a flexible direct-to-object printing system. Instead of mechanically mounting pre-formed circuits, the system uses controlled material extrusion to form circuits and embed components directly onto the non-planar surface, substituting mechanical alignment with precision-controlled material deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and accurate printing of electrical circuits on non-planar objects with the direct installation of electronic components, reducing production time and improving process efficiency by integrating circuit formation and component placement into a single process.
Implementation Method 1
a multi-nozzle extruder configured to extrude a material containing conductive material toward an object secured by a holder to form an electrical circuit on the object
Implementation Method 2
an aerosol printer configured to generate an aerosol stream and condense the aerosol stream onto a substrate to form one or more electrical circuits on the substrate
Data Source
AI summary
An method for operating an object printing system printer prints electrical circuits on non-planar areas of objects and accurately places electronic components within the printed circuits. The method includes operation of a direct-to-object printer to form an electrical circuit on an object secured within the direct-to-object printer and operation of an electronic component placement system to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to a generation of a signal by the direct-to-object printer for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.