Direct PCB-to-PCB Contact Assembly for Signal Integrity
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Solution Overview
Problem
Increasing the density of electrical contacts between printed circuits to accommodate a higher number of signal and ground paths without compromising signal integrity is a challenge, as higher density often leads to decreased signal integrity.
Innovation Solution
A printed circuit assembly design that directly engages secondary printed circuits with the base printed circuit using electrical bonding material, eliminating the need for intervening connector assemblies, allowing for increased contact density while maintaining signal integrity by optimizing contact patterns and orientations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the density of mating contacts of the electrical connector assembly is increased to accommodate more signal and ground paths, then the quantity of electrical contacts is improved, but the signal integrity deteriorates
Solution Approach 1:
The patent extracts the electrical connector assembly housing and mating contacts from the system, eliminating the intermediary connector entirely. Instead, the secondary printed circuit board is mounted directly to the first printed circuit board, with electrical contacts on the secondary PCB mating directly with signal and ground paths on the first PCB. This extraction removes the source of signal integrity degradation while preserving the ability to accommodate high contact density.
Solution Approach 2:
The patent merges the functions of the electrical connector assembly with the printed circuit boards themselves. The secondary PCB is directly mounted to the first PCB, combining what were previously separate components (connector housing, mating contacts, and PCBs) into a direct integration. This merging eliminates the intermediary connector that degraded signal integrity while maintaining electrical connection functionality.
2Quantity of substance
If the density of electrical contacts on the printed circuit is increased to accommodate more electrical leads and coaxial cables, then the quantity of electrical connections is improved, but the device complexity increases
Solution Approach 1:
The patent extracts the complex electrical connector assembly from the system and replaces it with a direct mounting arrangement. The secondary PCB is mounted directly to the first PCB using conventional PCB mounting techniques, eliminating the need for separate connector housings, mating contacts, and assembly procedures. This extraction reduces device complexity while maintaining the ability to accommodate high numbers of electrical connections.
Solution Approach 2:
The patent makes the printed circuit boards serve multiple functions: they provide both the electrical connection paths and the mechanical mounting structure. The secondary PCB is both the electrical interface for multiple coaxial cables and the mechanically mounted component, eliminating the need for separate connector housings. This multi-functionality reduces device complexity by consolidating roles.
3Ease of manufacture
If an electrical connector assembly is used to connect printed circuits, then the ease of manufacture is improved through modular assembly, but the volume of the assembly increases due to the connector housing
Solution Approach 1:
The patent extracts the housing and mating contacts from the electrical connector assembly, eliminating the voluminous components. The secondary PCB is mounted directly to the first PCB without requiring a connector housing, dramatically reducing the volume occupied by the connection interface while maintaining modular assembly capabilities through standard PCB mounting procedures.
Solution Approach 2:
The patent merges the electrical connection function with the PCB mounting structure, eliminating the need for separate connector housings. The secondary PCB serves both as the electrical interface and the mechanically mounted component, consolidating what were previously separate voluminous elements into a compact integrated assembly.
Data Source
AI summary
A printed circuit assembly includes a base printed circuit having a printed circuit receiving area and a plurality of electrical contacts provided on the printed circuit receiving area. The printed circuit assembly also includes a secondary printed circuit having a secondary substrate including a mating edge and a plurality of secondary contacts provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.