Direct-Mounted Semiconductor Die With Datum Wells for Alignment
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Solution Overview
Problem
The increasing use of optical semiconductor devices in portable and wearable devices necessitates a reduction in system size, cost, and elimination of redundancy, particularly in applications like head-mounted displays where the semiconductor package sizes are large and redundant.
Innovation Solution
A semiconductor die is directly mounted to a system board using a datum structure with openings forming wells around bond fingers, eliminating the need for a semiconductor device package and providing alignment and positioning features, thus reducing volume and cost while improving thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a semiconductor device is packaged in a traditional package substrate, then the device is protected and easy to handle, but the system size and volume increase
Solution Approach 1:
The patent extracts the semiconductor die directly from the traditional package substrate and mounts it onto the system board. This eliminates the package substrate as a separate component, thereby reducing system volume while maintaining device functionality through direct mounting and bonding techniques.
Solution Approach 2:
The patent merges the package substrate function with the system board by directly mounting the semiconductor die onto the system board. The system board assumes both its original functions and the package substrate's support and connection functions, eliminating redundancy and reducing overall system volume.
2Ease of manufacture
If a traditional package substrate is used, then the semiconductor device is protected, but the system cost increases
Solution Approach 1:
The patent removes the package substrate from the bill of materials and mounts the semiconductor die directly to the system board. This extraction eliminates the cost of the package substrate while maintaining device protection through alternative mounting and encapsulation techniques.
Solution Approach 2:
The patent combines the package substrate's protective and supportive functions directly into the system board structure. By integrating these functions into an existing component (the system board), the patent eliminates the need for a separate package substrate, thereby reducing manufacturing cost.
3Volume of moving object
If a semiconductor die is directly mounted to the system board, then volume is reduced, but alignment precision becomes more critical
Solution Approach 1:
The patent incorporates alignment marks and positioning features directly into the system board before the semiconductor die is mounted. These pre-established reference features guide the precise placement of the die, ensuring accurate alignment is achieved during the direct mounting process.
Solution Approach 2:
The patent uses alignment marks and positioning structures as intermediary reference elements between the system board and the semiconductor die. These intermediaries facilitate precise alignment by providing visual or mechanical references that guide the mounting process, ensuring accurate placement despite the elimination of the package substrate.
Data Source
AI summary
An example includes: a system board having a surface; bond fingers on a surface of the system board; a semiconductor device on the surface of the system board, the semiconductor device comprising a semiconductor die having a surface, the semiconductor die comprising bond pads on the surface; conductors coupling the bond pads to the bond fingers; and a datum structure on the surface of the system board, the datum structure having openings that form wells with sides around the bond fingers.