Direct Substrate Bonding for AR Display Pixel Miniaturization
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Solution Overview
Problem
Existing display devices face challenges in miniaturization due to the size and thickness of pixels, which are not adequately addressed by conventional methods involving micro-lenses and adhesive layers in augmented reality/virtual reality applications.
Innovation Solution
A display device design that eliminates the need for an adhesive layer and dam structure by directly disposing a second substrate with concave depressions over a lens array layer, using optically clear materials and laser patterning to create micro-patterns for miniaturization, thereby reducing pixel width and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods with adhesive layers and dam structures are used to attach micro-lenses to substrates, then the micro-lens can be securely attached, but the pixel width and device thickness increase
Solution Approach 1:
The patent removes the adhesive layer and dam structure from the conventional micro-lens attachment system. By extracting these intermediate components, the design achieves direct bonding between the micro-lens and substrate, eliminating the need for additional materials and structures that would increase pixel width and device thickness.
Solution Approach 2:
The patent merges the attachment function directly into the substrate-micro-lens interface by forming a bonding structure that integrates the adhesive and dam structure functions into a single integrated layer. This consolidation eliminates multiple separate components and reduces the overall structural complexity and dimensional footprint.
2Reliability
If adhesive layers and dam structures are used to form micro-lens arrays, then the micro-lenses can be securely mounted, but the fabrication process becomes more complex
Solution Approach 1:
The patent extracts and removes the adhesive layer formation step and the dam structure formation step from the fabrication process. By eliminating these separate processes, the number of fabrication steps is reduced, and the process complexity is decreased while maintaining secure micro-lens mounting through direct bonding.
Solution Approach 2:
The patent combines the attachment function into a single integrated bonding structure that is formed in one step, eliminating the need for separate adhesive layer deposition and dam structure formation steps. This merging of functions simplifies the fabrication process while ensuring secure mounting.
3Strength
If adhesive layers are used to attach substrates to micro-lenses, then bonding can be achieved, but additional steps for forming adhesive layers and dam structures are required
Solution Approach 1:
The patent removes the steps for forming adhesive layers and dam structures from the fabrication sequence. By extracting these unnecessary intermediate steps, the process achieves direct substrate-to-micro-lens bonding, reducing fabrication time and improving productivity while maintaining adequate bonding strength.
Solution Approach 2:
The patent performs the bonding structure formation as a preliminary integrated step during the micro-lens array fabrication process, rather than adding it as a subsequent separate process. This preliminary action eliminates the need for later adhesive layer formation steps and improves overall fabrication efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances pixel miniaturization, simplifies the fabrication process, and improves light extraction efficiency, contributing to better resolution and reduced device thickness.
Implementation Method 1
forming a micro-pattern including multiple concave depressions in a base substrate; the forming of the micro-pattern may include removing portions of the base substrate by irradiating a laser beam onto the base substrate
Data Source
AI summary
A display device includes a first substrate, an organic light-emitting-element layer disposed on the first substrate, an encapsulation layer disposed on the organic light-emitting-element layer, and a lens array layer disposed on the encapsulation layer. The lens array layer includes a lens layer including multiple lenses, and a second substrate disposed (e.g., directly disposed) on the lenses. The second substrate includes multiple concave depressions corresponding to shapes of the lenses.