Direct Substrate Cooling Structure With Vertical Posts for Semiconductor Chips
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Solution Overview
Problem
Existing cooling systems for semiconductor components, particularly those with linear structures, have limitations in maximizing heat conductivity and radiation efficiency, necessitating the development of direct cooling methods using coolants to enhance performance.
Innovation Solution
A cooling system where a semiconductor component with a semiconductor chip is joined to a cooling apparatus featuring a coolant flow path and vertically arranged cooling posts, allowing direct contact between the coolant and the substrate to improve heat conductivity and radiation efficiency, with the coolant flowing smoothly through a designed post structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a simple linear cooling part member structure is used, then the device complexity is reduced, but the heat conductivity efficiency and heat radiation efficiency are insufficient
Solution Approach 1:
The cooling part member is divided into multiple segments including a cooling plate, multiple cooling posts, and a base plate. This segmentation allows the coolant to flow through multiple pathways and contact different surfaces, significantly improving heat conductivity efficiency while maintaining manageable structural complexity
Solution Approach 2:
The cooling structure transitions from a simple linear form to a three-dimensional configuration with vertically arranged cooling posts extending from the cooling plate to the base plate. This dimensional change creates additional heat dissipation surfaces and improves both heat conductivity and radiation efficiency
2Device complexity
If indirect cooling method is used, then the device structure is simpler, but the heat radiation efficiency cannot be maximized
Solution Approach 1:
The cooling posts act as intermediaries that directly conduct heat from the substrate to the coolant flowing through the cooling plate. This intermediary structure enables more efficient heat transfer compared to indirect cooling methods, improving heat radiation efficiency while maintaining structural simplicity
Solution Approach 2:
The system uses hydraulic cooling by circulating coolant through the cooling plate and base plate. This hydraulic approach enables direct cooling of the substrate through the cooling posts, significantly improving heat radiation efficiency compared to air-based indirect cooling methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively enhances cooling efficiency by directly cooling the substrate and efficiently radiating heat, regardless of the substrate structure, through the use of a coolant flow path and vertically arranged cooling posts, thereby improving overall heat management for semiconductor components.
Implementation Method 1
a coolant is supplied to a substrate, on which a semiconductor chip is installed, through an opening member of the cooling apparatus so that a surface of the substrate may be directly cooled by the coolant
Implementation Method 2
improve heat conductivity and radiation efficiency
Implementation Method 3
a cooling post structure, which enables the coolant to smoothly flow, is used to further improve cooling efficiency
Data Source
Figure 1(a)~1(b)
Figure 2
Figure 3
AI summary
The present invention relates to a cooling system where a semiconductor component including a semiconductor chip and a cooling apparatus are joined, wherein a coolant is supplied to a substrate, on which a semiconductor chip is installed, through an opening member of the cooling apparatus so that a surface of the substrate may be directly cooled by the coolant so as to improve cooling efficiency, and a cooling post structure, which enables the coolant to smoothly flow, is used to further improve cooling efficiency.