Direct Substrate Cooling Structure for Semiconductor Heat Dissipation

Solution Overview

Problem

Existing cooling systems for semiconductor components, particularly those with linear structures, have limitations in maximizing heat conductivity and radiation efficiency, necessitating the development of direct cooling methods that enhance heat transfer.

Innovation Solution

A cooling system where a semiconductor component with a semiconductor chip is joined to a cooling apparatus featuring a cover body with a coolant flow path and vertically arranged cooling posts, allowing direct coolant contact with the substrate to improve heat dissipation, with adjustable substrate exposure and coolant flow paths to optimize cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a simple linear cooling part member structure is used, then the device complexity is reduced and ease of manufacture is improved, but the heat conductivity efficiency and heat radiation efficiency deteriorate

Engineering Contradiction:

Improveease of manufactureVSAvoidheat conductivity efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The cooling part member is divided into multiple functional sections: a contact section that contacts the semiconductor device, a coolant flow path section with defined flow channels, and a radiation section with extended surface area. This segmentation allows each section to be optimized for its specific function while maintaining manufacturing feasibility through modular construction

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cooling structure transitions from a simple linear one-dimensional form to a three-dimensional structure with vertical coolant flow paths and upward-extending radiation fins. This dimensional expansion increases the heat radiation surface area and improves heat transfer efficiency without significantly complicating the manufacturing process

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If a simple linear cooling part member structure is used, then the device complexity is reduced, but the heat radiation efficiency deteriorates

Engineering Contradiction:

Improvedevice complexityVSAvoidheat radiation efficiency

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The cooling part member is divided into multiple functional sections: a contact section that contacts the semiconductor device, a coolant flow path section with defined flow channels, and a radiation section with extended surface area. This segmentation allows each section to be optimized for its specific function while maintaining manufacturing feasibility through modular construction

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cooling structure transitions from a simple linear one-dimensional form to a three-dimensional structure with vertical coolant flow paths and upward-extending radiation fins. This dimensional expansion increases the heat radiation surface area and improves heat transfer efficiency without significantly complicating the manufacturing process

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If indirect cooling method is used, then the device complexity is reduced, but the cooling efficiency deteriorates

Engineering Contradiction:

Improvedevice complexityVSAvoidcooling efficiency

Core Design Contradiction:

Device complexityVSProductivity

Solution Approach 1:

The coolant flow path is extracted and defined within the cooling part member itself, separating the cooling function from the structural support function. This allows direct coolant contact with the substrate while maintaining a relatively simple overall device structure

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The cooling part member acts as an intermediary element that directly contacts both the semiconductor substrate and the coolant, enabling efficient heat transfer from the substrate through the cooling part member to the circulating coolant without requiring complex multi-component cooling systems

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively enhances cooling efficiency by directly cooling the substrate and heat-generating semiconductor chip, improving heat conductivity and radiation through optimized coolant flow and substrate exposure configurations.

Implementation Method 1

heat generated and transmitted from the semiconductor chip to the substrates, which are exposed through the opening members, and the cooling posts is directly cooled by a coolant

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

a coolant circulates... a coolant flow path in an inner space thereof... at least one inlet, where a coolant flows in, and at least one outlet, from where a coolant is discharged

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11908766B2Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined

Publication Date: 2024.02.20 JMJ KOREA CO LTD

AI summary

The present invention relates to a cooling system where a semiconductor component including a semiconductor chip and a cooling apparatus are joined, wherein a coolant is supplied to a substrate, on which a semiconductor chip is installed, through an opening member of the cooling apparatus so that a surface of the substrate may be directly cooled by the coolant so as to improve cooling efficiency, and a cooling post structure, which enables the coolant to smoothly flow, is used to further improve cooling efficiency.