Direct Transfer of Semiconductor Device Die
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Solution Overview
Problem
Conventional semiconductor device fabrication processes result in packaged devices that are significantly larger and thicker than the unpackaged dies, limiting the thickness of the final product and increasing manufacturing time and cost due to the need for packaging and handling.
Innovation Solution
A direct transfer apparatus and method that securely aligns and transfers unpackaged semiconductor device dies from a wafer tape to a product substrate, eliminating the need for packaging by using a transfer mechanism to press the dies onto the substrate, thereby reducing adhesion with the wafer tape and increasing adhesion with the substrate, allowing for precise alignment and placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging process is used, then device protection and interface capability are improved, but device thickness and volume increase significantly
Solution Approach 1:
The patent extracts the protective packaging from the final product by implementing direct die attachment to the circuit board. The die is transferred directly from the wafer to the board without intermediate packaging, eliminating the need for plastic or ceramic enclosures while maintaining electrical connectivity through direct bonding of die contacts to board traces.
Solution Approach 2:
The patent merges the die attachment process with the circuit board integration process. The die is directly bonded to the circuit board traces, combining the mounting function with the electrical connection function, thereby eliminating separate packaging components and reducing overall device volume.
2Reliability
If conventional packaging process is used, then device protection is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent removes the time-consuming packaging steps from the manufacturing process by implementing direct die attachment. The die is transferred and bonded directly to the circuit board in a single integrated process, eliminating separate packaging operations and reducing total manufacturing cycle time.
Solution Approach 2:
The patent combines multiple manufacturing operations into a single integrated process. The die transfer, alignment, and bonding operations are merged into one continuous process, eliminating the need for separate packaging steps and improving manufacturing throughput.
3Manufacturing precision
If pick and place sorting process is used, then die quality sorting is improved, but handling complexity and time increase
Solution Approach 1:
The patent performs die sorting and selection during the wafer fabrication process itself, before the die are separated. Quality metrics are evaluated and die locations are identified in advance, allowing direct transfer of selected die to the circuit board without requiring subsequent pick-and-place sorting operations.
Solution Approach 2:
The patent extracts the sorting function from the post-dicing handling process and integrates it into the wafer fabrication process. By identifying and selecting quality die during manufacturing, the need for complex subsequent sorting and handling operations is eliminated.
Data Source
AI summary
A system for performing a direct transfer of a semiconductor device die includes a first conveyance mechanism to convey a first substrate, and a second conveyance mechanism to convey a second substrate with respect to the first substrate. The first substrate includes a first side and a second side, and the semiconductor device die is disposed on the first side of the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to a first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also includes a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.