Direct Transfer Apparatus for Semiconductor Die Packaging
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Solution Overview
Problem
Conventional semiconductor device fabrication processes result in packaged devices that are significantly larger and thicker than the unpackaged dies, limiting the thickness and efficiency of the final circuit assembly due to the need for protective packaging, which also increases manufacturing time and cost.
Innovation Solution
A machine and process for directly transferring unpackaged semiconductor device dies from a wafer tape to a product substrate without packaging, using a transfer mechanism that aligns and affixes the dies with precision, reducing adhesion to the wafer tape and increasing adhesion to the substrate, allowing for thinner and more efficient product assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging is used to protect semiconductor dies, then reliability is improved, but the thickness and volume of the final product increase significantly
Solution Approach 1:
The patent extracts the protective packaging from the final product by implementing direct die attachment to the circuit board. The die is transferred directly from the wafer to the board without being enclosed in a package, eliminating the protective enclosure while maintaining device functionality through direct mounting and wire bonding.
Solution Approach 2:
The patent segments the manufacturing process into distinct stages: die preparation on the wafer, precise transfer to the circuit board, and subsequent wire bonding. This segmentation allows the die to be handled and protected only when necessary during manufacturing, rather than requiring permanent packaging.
2Reliability
If conventional packaging is used for semiconductor dies, then device protection is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent merges multiple operations into a single direct transfer process. The die is picked from the wafer and placed directly onto the circuit board in one continuous operation, eliminating separate packaging and unpackaging steps that would consume additional manufacturing time and resources.
Solution Approach 2:
The patent performs preliminary preparation of the die on the wafer substrate, including forming contact pads and testing, before transfer. This preliminary action ensures the die is ready for direct mounting without requiring post-package testing or adjustment, reducing overall manufacturing time.
3Object-affected harmful factors
If conventional packaging is used, then device protection from environmental factors is improved, but the final product becomes larger and less efficient
Solution Approach 1:
The patent uses the circuit board as an intermediary substrate that provides both mechanical support and environmental protection for the die. The board acts as a mediator between the die and the external environment, protecting the device while maintaining a compact form factor compared to traditional packaging.
Solution Approach 2:
The patent replaces rigid packaging enclosures with thin film wire bonds that connect the die to the circuit board. These thin connections provide necessary electrical interfacing while occupying minimal space, eliminating the need for bulky protective shells.
Data Source
AI summary
An apparatus includes a transfer element that is disposed adjacent the wafer tape. A tip end of the transfer element has a footprint sized so as to span across a group of dies on the wafer tape. An actuator is connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the wafer tape to press the group of dies into contact with a circuit trace on the product substrate.