Direct Write Ink Curing via Induction Heating
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Solution Overview
Problem
Existing Direct Write and additive manufacturing processes require substrates to be placed in an oven for thermal curing, which limits ink performance, imposes registration accuracy challenges, and is costly and time-consuming, especially for large substrates with complex shapes.
Innovation Solution
Thermal curing is performed in situ using an induction coil with an oscillating current, which induces eddy currents and Joule heating for ink fixation, allowing for localized heating and self-monitoring of the curing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If oven-based thermal curing is used, then inks can be cured and fixed, but the curing temperature is limited by substrate operating temperature, compromising ink performance
Solution Approach 1:
The patent applies local induction heating to specific regions where ink is deposited, rather than heating the entire substrate uniformly. This allows the ink to be cured at high temperatures locally without exposing the entire substrate to temperatures that would compromise its operating reliability or damage other substrate elements.
Solution Approach 2:
The curing process is segmented into localized heating zones corresponding to ink deposition areas. The induction heating means is positioned to heat only the regions containing ink, separating the curing function from the substrate's overall thermal constraints and enabling higher curing temperatures without affecting substrate performance.
2Manufacturing precision
If substrate is placed in oven for curing after each layer, then ink can be consolidated, but registration accuracy problems occur and complex costly tooling is required
Solution Approach 1:
The patent combines the ink deposition and curing operations into a single integrated process step. The induction heating means is positioned to cure ink immediately after deposition while the substrate remains in the printing position, eliminating the need for separate oven curing steps and the associated registration and tooling complexities.
Solution Approach 2:
The curing action is performed preliminarily and immediately after ink deposition, while the substrate is still in the printing position. This preliminary curing maintains registration accuracy by avoiding subsequent substrate handling and repositioning operations that would require complex tooling.
3Area of stationary object
If substrate is large, then Direct Write can be applied, but it is not practical to place it in oven for curing
Solution Approach 1:
The induction heating means applies localized thermal energy only to the regions containing ink, rather than heating the entire large substrate. This allows curing of inks on large substrates without requiring the impractical approach of placing the entire large substrate in an oven.
Solution Approach 2:
The curing process is segmented into discrete localized heating zones that can be applied independently across large substrate areas. This enables practical curing of large substrates by treating only the necessary regions with induction heating rather than requiring complete substrate heating in an oven.
4Productivity
If multiple layers are deposited with oven curing between each, then each layer can be consolidated, but removal and realignment is costly and time consuming
Solution Approach 1:
The patent enables continuous processing by performing curing immediately after each ink deposition step without interrupting the workflow for substrate removal and repositioning. The induction heating means maintains continuous operation, consolidating layers as they are deposited without breaking the production flow.
Solution Approach 2:
The deposition and curing operations are merged into a single continuous process step. By combining these operations and eliminating the intermediate substrate handling steps, the system achieves continuous production with reduced cycle time and increased productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient, localized curing of Direct Write inks on complex substrates without the need for oven-based thermal curing, improving registration accuracy and reducing processing time and costs, while maintaining ink performance.
Implementation Method 1
The coil is placed above the region to be cured. The oscillating current induces charge movement (eddy currents) in the region to be cured and the resistance to this charge movement causes Joule heating in the affected area
Implementation Method 2
the resistance to this charge movement causes Joule heating in the affected area and thus curing and sintering the inks
Data Source
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AI summary
A Direct Write method of forming components on a substrate by deposition of inkby thermally curing the inkinsitu, whichmethod overcomes the need for curing byplacingthe substrate in anoven. The curing is performed in a preferred embodiment using an induction coil (6) through which an oscillating current is passed. The coil (6) is placed above the region in which Direct Write ink has been deposited. The oscillating current induces eddy currents in the inktocause heating of the inkand thus fix the ink by curing, sinteringetc.