Direct-Write Printing Circuitry Using Conductive Paste Dispensing
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Solution Overview
Problem
Current circuit board prototyping methods are costly, time-consuming, and hazardous, with additive techniques like inkjet printing facing issues of low conductivity and reliability due to solvent-based inks, while subtractive methods like chemical etching pose health risks and inefficiencies, and screen printing is impractical for iterative designs due to stencil requirements.
Innovation Solution
A direct-write printing method using conductive polymer thick film (PTF) and insulating pastes with a heated platform and dispensing heads that apply downward force to deposit materials in a controlled manner, allowing for multilayer circuit board fabrication with improved conductivity and reduced waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If inkjet printing with solvent-based conductive inks is used, then rapid processing and minimal setup are achieved, but conductivity and reliability are reduced
Solution Approach 1:
The patent changes the material parameter from solvent-based ink to paste formulation, and changes the deposition parameter from droplet ejection to direct write dispensing. This allows the conductive material to be deposited in controlled patterns while maintaining high productivity and achieving improved conductivity and reliability through better material utilization and trace formation.
2Ease of manufacture
If chemical etching process is used, then conductive patterns are produced on copper-clad base material, but toxic and corrosive chemicals are employed creating health risks
Solution Approach 1:
The patent replaces the chemical etching process with a direct write dispensing system that deposits conductive paste patterns directly onto the substrate. This mechanical deposition method eliminates the need for toxic chemicals while maintaining the ability to create precise conductive patterns, thereby removing health risks associated with chemical exposure.
3Ease of manufacture
If screen printing method is used, then conductive paste is deposited onto substrate, but iterative stencil creation is required reducing efficiency
Solution Approach 1:
The patent extracts and eliminates the stencil component from the screen printing process. The direct write dispensing system uses computer-controlled movement to deposit paste directly in the desired pattern without requiring physical stencils. This removes the time-consuming stencil creation and replacement steps while maintaining precise pattern deposition capability.
4Productivity
If subtractive milling process is used, then circuit boards are produced with limited setup time, but only rigid substrates and single or dual sided boards can be created
Solution Approach 1:
The direct write dispensing system is designed to be universally applicable to various substrate types including rigid and flexible materials, and can create single-sided, dual-sided, and multilayer circuit boards. The system uses computer-controlled dispensing that can adapt to different geometries and layer configurations, providing multi-functionality that overcomes the limitations of subtractive milling methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient, safe, and cost-effective production of multilayer circuit boards with enhanced conductivity and solderability, reducing the need for iterative stencil creation and minimizing hazardous materials, while allowing for complex designs and rapid prototyping.
Implementation Method 1
a heated platform
Implementation Method 2
Once the ink is ejected onto a base material, the solvent is evaporated leaving behind conductive metallic traces
Implementation Method 3
a system to apply a substantially downward force within the dispensing head
Data Source
AI summary
The present disclosure provides a novel apparatus and method for printing circuitry that can dispense conducting traces, insulating traces, solder paste, and other materials onto a substrate material in a manner that allows for convenient prototyping of printed circuit boards.