Directional Coupler Warpage Prevention Conductor

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Solution Overview

Problem

Existing electronic components with directional couplers face warpage issues due to differing contraction ratios of dielectric substrate layers when terminals are only provided on the bottom surface, leading to size increase and structural instability.

Innovation Solution

Incorporating a warpage prevention conductor on the top surface of the laminate that overlaps with external electrodes, ensuring even contraction ratios between the top and bottom surfaces by not providing additional conductor layers on the bottom surface, thus preventing warpage during firing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If terminals are provided only on the bottom surface of the dielectric substrate, then the component size is reduced by eliminating side surface conductors, but warpage occurs due to different contraction ratios between top and bottom surfaces

Engineering Contradiction:
Improvecomponent sizeVSAvoidstructural stability
Core Design Contradiction:
Area of stationary objectVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by providing a conductor layer specifically on the top surface of the dielectric substrate where needed, rather than uniformly across the entire substrate. This localized conductor layer balances the contraction ratios between top and bottom surfaces during firing, preventing warpage while maintaining the compact design with terminals only on the bottom surface.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If a warpage prevention conductor is added on the top surface, then structural stability is improved by balancing contraction ratios, but device complexity increases due to additional conductor layers

Engineering Contradiction:
Improvestructural stabilityVSAvoidconductor layer configuration
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The conductor layer on the top surface serves multiple functions: it acts as a warpage prevention mechanism by balancing contraction ratios during firing, and simultaneously functions as part of the electromagnetic coupling structure between the main line and sub-line. This multi-functionality reduces device complexity by combining warpage prevention with the directional coupler structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents warpage in the laminate by aligning the contraction ratios of the top and bottom surfaces, maintaining structural integrity and reducing component size by eliminating the need for side surface conductors.

Implementation Method 1

a sub-line provided within the laminate and electromagnetically coupled to the main line to provide a directional coupler

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Implementation Method 2

when firing the dielectric substrate 502, the dielectric layers, the first terminal 508, and the fourth terminal 514 contract in different contraction ratios

Methodology Applied
Scientific EffectThermal contraction: Thermal Contraction

Data Source

PatentUS8754723B2Electronic component including directional coupler
Publication Date: 2014.06.17 MURATA MFG CO LTD
  • US8754723B2 patent drawing
  • US8754723B2 patent drawing
  • US8754723B2 patent drawing

AI summary

External electrodes are provided on a bottom surface of a laminate, and are connected to both ends of a main line and both ends of a sub-line, respectively. A warpage prevention conductor is provided on an insulating material layer that is provided on a top surface side of the laminate with respect to insulating material layers to which the main line is provided and with respect to insulating material layers to which the sub-line is provided. The warpage prevention conductor overlaps with the external electrodes when seen from a z-axis direction in a plan view. A conductor layer that is not connected to the main line or the sub-line is not provided on any of the insulating material layers provided on a bottom surface side of the laminate with respect to the insulating material layer on which the warpage prevention conductor is provided.