Disc Spring Elastic Member for High Load in Narrow Gaps
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Solution Overview
Problem
Existing technologies using a simple thin metal plate as a pressing plate in semiconductor devices cannot apply a high load, leading to rattling and decreased cooling efficiency, especially in narrow gaps.
Innovation Solution
An elastic member with a plate-like shape comprising multiple disc springs arranged side by side and supported by a frame-like structure, allowing for high load application in narrow gaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a simple thin metal plate is used as a pressing plate, then the device structure is simple and easy to manufacture, but the pressing plate cannot apply a high load
Solution Approach 1:
The pressing plate is segmented into multiple disc springs arranged in parallel, where each disc spring contributes to the overall load capacity. This segmentation allows the structure to achieve high load-bearing capability through the cumulative effect of multiple elastic elements while maintaining manufacturing simplicity.
Solution Approach 2:
The pressing plate uses a composite structure combining multiple disc springs with a support part, creating a composite elastic member that integrates the advantages of individual components to achieve both high load capacity and structural simplicity.
2Ease of manufacture
If a simple thin metal plate is used as a pressing plate, then the manufacturing cost is low, but the semiconductor module cannot be pushed strongly against the heat sink
Solution Approach 1:
The pressing plate is divided into multiple disc springs that work together to provide sufficient pressing force, ensuring reliable contact between the semiconductor module and heat sink while maintaining cost-effectiveness through the use of simple elastic elements.
Solution Approach 2:
The pressing plate's load capacity is enhanced by changing the parameters of the disc springs, such as their number, arrangement, and individual spring characteristics, allowing the system to achieve high pressing force without increasing manufacturing complexity.
3Volume of moving object
If an elastic member is arranged in a narrow gap, then the device miniaturization is achieved, but the elastic member must apply a high load which is difficult to achieve
Solution Approach 1:
The pressing force is generated in the thickness direction of the plate-like elastic member, utilizing the out-of-plane dimension to achieve high load capacity within a narrow gap constraint. This dimensional approach allows the elastic member to be thin yet powerful.
Solution Approach 2:
Multiple disc springs are arranged in parallel within the narrow gap, with each spring contributing to the total load capacity. This segmentation enables the elastic member to achieve high pressing force while maintaining a compact thickness suitable for narrow gaps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastic member can apply a high load evenly over a wide range, reducing rattling and enhancing cooling efficiency in semiconductor modules.
Implementation Method 1
an elastic member having a plate-like shape, including a plurality of disc springs arranged side by side in a plane
Data Source
AI summary
An elastic member having a plate-like shape, includes a plurality of disc springs arranged side by side in a plane; and a support part integrally provided with the plurality of disc springs in the plane and around the plurality of disc springs, and supporting the plurality of disc springs.