Disconnect Relay Layout for Compact Thermal Management
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Solution Overview
Problem
Conventional disconnect devices face challenges in maintaining operation reliability while minimizing size, as reducing relay spacing for improved efficiency leads to increased temperature rise and potential reliability issues.
Innovation Solution
The disconnect device is designed with relays positioned closer to power storage ends, enhancing thermal coupling with a heatsink, and employing a substrate layout that aligns heat transfer parts to optimize heat dissipation, particularly for discharging relays, thereby reducing conductor length and DC resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If relays are separated with large intervals, then temperature rise in relays and protection device is suppressed, but device size increases
Solution Approach 1:
The substrate is designed with differentiated thermal conductivity regions: a first region with lower thermal conductivity and a second region with higher thermal conductivity. The relays are arranged such that those generating more heat are positioned over the high thermal conductivity region, while those generating less heat are over the low thermal conductivity region. This local differentiation allows tailored heat dissipation for each relay based on its thermal characteristics, enabling closer relay spacing without uniform overheating.
Solution Approach 2:
The substrate's thermal management is segmented into distinct regions with different thermal properties. The first region (lower thermal conductivity) and second region (higher thermal conductivity) are spatially separated and assigned to different relay groups. This segmentation allows independent thermal optimization for each relay cluster, resolving the contradiction between compact arrangement and temperature control.
2Loss of energy
If relays are positioned closer to power storage ends, then conductor length and DC resistance are reduced, but heat dissipation becomes more challenging
Solution Approach 1:
The substrate incorporates regions with different thermal conductivities positioned at specific locations. The high thermal conductivity region is strategically placed under relays that require superior heat dissipation, while the low thermal conductivity region is placed under relays with lower thermal demands. This localized thermal property differentiation enables the system to achieve both short conductor lengths and effective heat dissipation simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses heat generation and temperature rise, particularly in discharging relays, improving overall operation reliability and efficiency.
Implementation Method 1
a substrate (3) having a first surface contacting the heatsink (2) and having a second surface opposite to the first surface
Implementation Method 2
A heat dissipating performance of the heatsink (2) on the third heat transfer part (20), the fourth heat transfer part (21), and the fifth heat transfer part (22) is higher than a heat dissipating performance of the heatsink (2) on the first heat transfer part (18) and the second heat transfer part (19)
Data Source
AI summary
A disconnect device includes a heatsink, a substrate, a first charging relay disposed on a first heat transfer part, a second charging relay disposed on a second heat transfer part, a first discharging relay disposed on a third heat transfer part, a second discharging relay disposed on a fourth heat transfer part, and first and second power storage ends. The first and second discharging relays are disposed closer to the first and second power storage ends than the first and second charging relays are. The first, second, third, and fifth heat transfer parts are aligned in a first direction. The fourth and fifth heat transfer parts are aligned in a second direction perpendicular to the first direction. A heat dissipating performance of the heatsink on the third, fourth, and fifth heat transfer parts is higher than a heat dissipating performance of the heatsink on the first and second heat transfer parts.