Discontinuous Seed Layer Structure to Prevent RDL Delamination
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Solution Overview
Problem
The issue of delamination between layers during the manufacturing of semiconductor devices due to stress in the redistribution layer (RDL) process is a challenge in achieving high integration and miniaturization.
Innovation Solution
A circuit structure is developed with a seed layer composed of discontinuous metal blocks on a dielectric layer, where the circuit layer is formed by electroplating on these blocks, creating a concave-convex surface to enhance bonding and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a whole seed layer is laid on the dielectric layer, then the manufacturing process is simple, but delamination occurs due to stress between layers
Solution Approach 1:
The seed layer is divided into multiple discontinuous metal blocks instead of forming a continuous layer. This segmentation creates a structure where individual metal blocks are distributed across the dielectric layer, reducing overall stress accumulation while maintaining local bonding areas that prevent delamination.
Solution Approach 2:
The discontinuous metal blocks create local variations in the seed layer structure, with each block providing localized bonding areas. This local quality approach allows stress to be distributed and managed at different locations, preventing uniform delamination while maintaining strong bonding where needed.
2Adaptability or versatility
If the number of RDL layers is increased to meet high integration requirements, then device functionality is improved, but stress between layers increases causing delamination
Solution Approach 1:
By segmenting the seed layer into discontinuous metal blocks in each RDL layer, the structure accommodates multiple layers without proportional increase in stress. Each metal block acts as an independent stress management unit, allowing the stacking of multiple RDL layers while maintaining bonding stability.
3Ease of manufacture
If a continuous seed layer is used, then electroplating is easier to perform, but the bonding area is insufficient to prevent delamination
Solution Approach 1:
The seed layer is segmented into multiple discontinuous metal blocks that are distributed across the dielectric layer. Each metal block serves as an electroplating substrate, and the collective arrangement of these blocks provides both sufficient total bonding area and effective stress distribution to prevent delamination.
Solution Approach 2:
The discontinuous metal blocks are arranged in a spatial distribution pattern across the dielectric layer surface. This dimensional arrangement increases the effective bonding area without requiring a continuous layer, allowing electroplating to occur on multiple discrete surfaces that collectively provide strong interlayer bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure strengthens the bonding effect between layers, improving process yield and preventing delamination, thus supporting high integration and miniaturization of semiconductor devices.
Implementation Method 1
electroplating a circuit layer on the seed layer by using the seed layer as a current conduction path
Data Source
AI summary
A circuit structure and a manufacturing method thereof are provided, in which a seed layer composed of a plurality of discontinuous metal blocks is formed on a dielectric layer, and a circuit layer is formed on the seed layer by electroplating. By roughening the overall surface of the plurality of discontinuous metal blocks and creating a relatively concave-convex structure, the bonding effect between the seed layer and the circuit layer formed thereon is strengthened, thereby preventing the problem of delamination and improving the process yield.