Discontinuous Thermal Interface Segments for Curved Surfaces

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Solution Overview

Problem

Achieving effective thermal energy transfer between two cylindrical or curved surfaces is challenging due to disparities in radii of curvature and geometric characteristics, leading to temperature differences and increased power requirements.

Innovation Solution

A high-performance thermal interface is developed using multiple discontinuous thermal interface segments with curved major surfaces that register with the curved surface of a heat source or heat sink, optimizing the Hertzian contact area for efficient phonon exchange and using thermal gap pads to compensate for curvature disparities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional clamps or fins are used to attach to cylindrical surfaces, then the structure can be assembled, but thermal energy transfer efficiency is poor due to curvature disparities creating temperature differences

Engineering Contradiction:
Improvethermal energy transfer efficiencyVSAvoidinterface geometry complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The thermal interface is divided into multiple discrete segments rather than using a single continuous clamp or fin structure. Each segment independently contacts the curved surface, allowing the interface to adapt to curvature disparities and achieve better thermal contact without requiring complex continuous geometries.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interface segments are designed with curved surfaces that match the curvature of the cylindrical heat source or heat sink. This curvature matching allows the segments to conform to the curved surface geometry, eliminating the temperature differences caused by mismatched curvatures in traditional flat or simple cylindrical interfaces.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If larger power is used to compensate for poor thermal contact, then cooling performance is maintained, but size, weight, and power requirements increase

Engineering Contradiction:
Improvecooling performanceVSAvoidthermal management system weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

By segmenting the thermal interface, the system achieves effective thermal contact with smaller individual segments that collectively provide sufficient heat transfer area. This eliminates the need for oversized clamps or fins that would increase weight while maintaining cooling performance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interface design changes the geometric parameters by using curved segments with specific radii of curvature that match the heat source or heat sink. This parameter optimization maximizes the Hertzian contact area, improving thermal transfer efficiency without requiring increased system size or weight.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the thermal interface is made discontinuous with multiple segments, then contact with curved surfaces is optimized, but manufacturing and assembly complexity increases

Engineering Contradiction:
Improvethermal contact qualityVSAvoidinterface manufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The discontinuous segmented structure is designed to simplify manufacturing by allowing individual segments to be produced separately using standard processes, then assembled together. Each segment can be manufactured independently with controlled tolerances, reducing the overall manufacturing complexity compared to creating a single complex continuous interface.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances thermal energy transfer efficiency, reduces temperature differences, and minimizes the size, weight, and power (SWaP) requirements for thermal management systems.

Implementation Method 1

has a specified area that is based on a Hertzian contact area defined partially by the curved surface of the object

Methodology Applied
Scientific EffectHertzian contact:

Implementation Method 2

The discontinuous thermal interface is configured to transfer thermal energy to or receive thermal energy from the curved surface of the object

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

optimizing the Hertzian contact area for efficient phonon exchange

Methodology Applied
Scientific EffectPhonon exchange:

Data Source

PatentUS11665858B2High-performance thermal interfaces for cylindrical or other curved heat sources or heat sinks
Publication Date: 2023.05.30 RAYTHEON CO
  • US11665858B2 patent drawing
  • US11665858B2 patent drawing
  • US11665858B2 patent drawing

AI summary

An apparatus includes multiple thermal interface segments collectively forming a discontinuous thermal interface configured to contact a curved surface of an object. The discontinuous thermal interface is configured to transfer thermal energy to or receive thermal energy from the curved surface of the object. Each of the thermal interface segments includes a major surface that is curved. The curved major surface of each of the thermal interface segments is configured to register with the curved surface of the object and has a specified area that is based on a Hertzian contact area defined partially by the curved surface of the object. The apparatus can also include a thermal gap pad configured to be compressed between the thermal interface segments and the object.