Discrete Antennas on Device Back Side for Millimeter Wave Routing
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Solution Overview
Problem
Traditional package substrate/antenna array designs for millimeter wave radios at 30 GHz or above suffer from routing losses and loss of package real estate, hindering efficient data transfer in applications like ultra-short range chip-to-chip communications and post silicon validation of SoC/CPU devices.
Innovation Solution
The use of discrete antennas with vertically disposed through substrate vias and high-performance millimeter wave substrates, such as glass, allows for compact and efficient signal transmission by electromagnetically coupling millimeter wave signals between radiating elements and substrate vias, reducing signal loss and package footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional package substrate/antenna array designs are used, then antenna functionality is achieved, but routing losses increase and package real estate is lost
Solution Approach 1:
The antenna structure is segmented into discrete individual antennas rather than a continuous array, allowing each antenna to be independently optimized and positioned. This segmentation reduces routing complexity and losses by eliminating the need for complex inter-element connections within a traditional substrate array.
Solution Approach 2:
The patent transitions from planar antenna arrays on the package substrate to three-dimensional discrete antennas positioned in space above the substrate. This dimensional change allows antennas to be vertically disposed and coupled through vias, reducing the need for extensive lateral routing and minimizing package real estate requirements.
2Area of stationary object
If traditional package substrate/antenna array designs are used, then antenna functionality is achieved, but package real estate is lost
Solution Approach 1:
By moving from two-dimensional planar arrays to three-dimensional discrete antenna structures with vertical positioning and via connections, the design utilizes the Z-dimension to reduce the footprint on the package substrate, thereby minimizing package real estate requirements.
Solution Approach 2:
The discrete antennas are nested within the package structure by positioning them above the substrate and coupling them through vertical vias that pass through the substrate. This nesting approach integrates the antennas into the existing package volume without requiring additional lateral space.
3Loss of energy
If discrete antennas with vertically disposed through substrate vias are used, then signal loss is reduced and package size is reduced, but manufacturing complexity increases
Solution Approach 1:
The through substrate vias are formed and prepared in advance before the discrete antennas are positioned and connected. This preliminary action allows for precise via placement and reduces the complexity of the final assembly process, as the connection pathways are already established when the antennas are installed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves electrical properties of antennas, reduces package size, and minimizes signal loss, enabling efficient data transfer in compact microelectronic packages for applications like chip-to-chip communications and wireless debug ports.
Implementation Method 1
electromagnetically coupling millimeter wave signals between radiating elements and substrate vias
Data Source
AI summary
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.