Discrete Antenna Package Layout With EMI Shielding for RF Performance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is an ongoing need for packages with antennas that offer improved transmitting and receiving performances.
Innovation Solution
A package design that includes a substrate with a first surface and a second surface, where the substrate has a plurality of interconnects, and features a discrete antenna device coupled to the first surface through solder interconnects, along with an integrated device on the second surface, and an EMI shield formed over the second surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If antennas are embedded in the substrate, then the package structure is simplified, but the transmitting and receiving performances are limited
Solution Approach 1:
The patent divides the antenna system from the substrate, using discrete antenna devices that can be separately optimized and configured. This segmentation allows the antennas to be positioned independently on the substrate surface rather than being constrained within the substrate layers, thereby improving transmitting and receiving performances while maintaining package structure simplicity.
Solution Approach 2:
The patent transitions from embedding antennas within the substrate (2D planar integration) to placing discrete antenna devices on the substrate surface (3D spatial arrangement). This dimensional change enables better antenna placement flexibility and configuration options, improving RF performance without significantly increasing overall package complexity.
2Reliability
If discrete antenna devices are used, then transmitting and receiving performances are improved, but the device complexity increases
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support, electrical interconnection, and a mounting platform for discrete antenna devices. By making the substrate multi-functional, the patent accommodates discrete antennas without requiring additional specialized structures, thereby improving performance while limiting complexity increase.
Solution Approach 2:
The discrete antenna devices are designed to be self-contained units that can be independently configured and mounted on the substrate. They bring their own functionality and requirements, allowing for modular integration that simplifies the overall package design process despite the increased component count.
3Object-affected harmful factors
If EMI shield is added, then electromagnetic interference is reduced, but the manufacturing complexity increases
Solution Approach 1:
The EMI shield is integrated with the substrate structure, combining the shielding function with the existing substrate manufacturing process. This merging approach allows the EMI shield to be formed as part of the substrate fabrication sequence, reducing the need for separate manufacturing steps and minimizing the increase in manufacturing complexity.
Solution Approach 2:
The EMI shield acts as an intermediary layer between the discrete antenna devices and other package components. It provides electromagnetic isolation without requiring direct modification of the antenna devices or substrate, thereby reducing EMI through a dedicated shielding layer that can be incorporated into the existing manufacturing flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package design enhances transmitting and receiving performances by allowing for better antenna placement and configuration, supporting various communication protocols, and providing effective EMI shielding.
Implementation Method 1
The package includes a shield formed over the second surface of the substrate, wherein the shield comprises an electromagnetic interference (EMI) shield
Data Source
AI summary
A package comprising a substrate, a first antenna device, and an integrated device. The substrate comprising a first surface and a second surface, where the substrate comprises a plurality of interconnects. The first antenna device is coupled to the first surface of the substrate, through a first plurality of solder interconnects. The integrated device is coupled to the second surface of the substrate. The package may include an encapsulation layer located over the second surface of the substrate, where the encapsulation layer encapsulates the integrated device. The package may include a shield formed over a surface of the encapsulation layer, where the shield includes an electromagnetic interference (EMI) shield.