Discrete Antenna Package Layout for Flexible RF Performance
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Solution Overview
Problem
Existing packages with embedded antennas face limitations in transmitting and receiving performance, requiring redesigns to meet specific operational requirements of cellular network operators and are constrained by substrate size and fabrication limitations.
Innovation Solution
A package design incorporating discrete antenna devices coupled to a substrate via solder interconnects, with an encapsulation layer and EMI shielding, allowing flexible configuration and efficient operation without substrate constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If antennas are embedded in the substrate, then the package structure is simplified and fabrication is easier, but the transmitting and receiving performance is limited and cannot meet diverse network operator requirements
Solution Approach 1:
The antenna system is segmented into discrete antenna devices that are separate from the substrate. These discrete antenna devices can be independently designed, fabricated, and selected based on specific network operator requirements, while the substrate serves a different function for housing integrated devices. This segmentation allows optimization of antenna performance without compromising substrate fabrication simplicity.
Solution Approach 2:
The antenna function is extracted from the substrate structure. Instead of embedding antennas within the substrate, the patent removes the antenna functionality to separate discrete components that can be coupled to the substrate via solder interconnects. This extraction enables the use of specialized antenna designs with superior transmitting and receiving performance while maintaining the substrate's original fabrication advantages.
2Reliability
If discrete antenna devices are used with separate fabrication, then transmitting and receiving performance is improved and diverse requirements are met, but device complexity and fabrication steps increase
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support, electrical interconnection through solder bumps, and housing for integrated devices. By making the substrate multi-functional, the patent reduces the need for additional specialized components and structures, thereby managing overall device complexity despite the addition of discrete antenna devices.
Solution Approach 2:
The package structure merges the substrate and discrete antenna devices into a unified assembly through solder interconnects. The encapsulation layer further merges all components (substrate, integrated devices, and antenna devices) into a single protected unit. This merging approach manages complexity by creating an integrated system rather than separate independent components.
3Adaptability or versatility
If discrete antenna devices are used with separate fabrication, then diverse network operator requirements can be met efficiently, but manufacturing processes become more complex
Solution Approach 1:
The package design is made dynamic and configurable. Different discrete antenna devices can be selected and coupled to the substrate depending on the specific network operator requirements. This dynamic configuration capability allows the same substrate platform to adapt to various antenna types and specifications, providing versatility without requiring completely different manufacturing lines for each application.
Solution Approach 2:
The substrate is prepared in advance with appropriate solder bump configurations and interconnect structures that can accommodate different discrete antenna devices. This preliminary preparation of the substrate enables later assembly of various antenna types without requiring complex real-time manufacturing adjustments, thereby managing manufacturing complexity while maintaining adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables packages to meet diverse network operator requirements efficiently, with improved transmitting and receiving capabilities, and enhanced performance through separate fabrication of antenna devices.
Implementation Method 1
a first antenna device coupled to the first surface of the substrate, through a first plurality of solder interconnects
Implementation Method 2
a shield coupled to a surface of the encapsulation layer, wherein the shield is configured to provide electromagnetic interference (EMI) shielding
Implementation Method 3
an encapsulation layer coupled to the second surface of the substrate, wherein a vertical surface of the encapsulation layer is coplanar with a vertical surface of the substrate, and wherein the encapsulation layer at least partially encapsulates the integrated device
Data Source
AI summary
A package comprising a substrate comprising a first surface and a second surface, wherein the substrate comprises a plurality of interconnects; a first antenna device coupled to the first surface of the substrate, through a first plurality of solder interconnects, wherein a portion of the first antenna device overhangs over the substrate such that a portion of the first antenna device does not vertically overlap with any portion of the substrate; a second antenna device coupled to the first surface of the substrate, through a second plurality of solder interconnects; an integrated device coupled to the second surface of the substrate; an encapsulation layer coupled to the second surface of the substrate, wherein a vertical surface of the encapsulation layer is coplanar with a vertical surface of the substrate, and wherein the encapsulation layer at least partially encapsulates the integrated device; and a shield coupled to a surface of the encapsulation layer.