Discrete Component Parasitic Inductance Reduction
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Solution Overview
Problem
The switching speed of transistors in power converters is limited by parasitic inductances of conductive connection elements, restricting the increase in switching frequency and leading to higher losses and larger passive components.
Innovation Solution
A discrete electronic component design with a semiconductor chip mounted on a printed circuit board, featuring separate connection pads for the source, drain, and gate, and an additional source control terminal, which reduces parasitic inductance by isolating the source control terminal from the conduction source terminal, allowing for higher switching speeds without increasing the risk of malfunctions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If transistors are controlled in switching at high frequency to reduce passive component sizes and losses, then converter efficiency and compactness are improved, but switching speed is limited by parasitic inductances of connection elements
Solution Approach 1:
The source terminal is segmented into two separate terminals: a first source terminal connected to the source metallization and a second source terminal connected to the source region. This segmentation allows the control circuit to access the source region through a separate path with minimal parasitic inductance, enabling faster switching speeds while maintaining high switching frequency operation.
Solution Approach 2:
The printed circuit board serves as an intermediary structure that provides separate connection paths. The first source terminal connects to the source metallization through one path while the second source terminal connects to the source region through another path with lower parasitic inductance, facilitating high-speed switching control.
2Speed
If separate connection pads are used for source, drain, and gate to reduce parasitic inductance, then switching speed is improved, but device complexity increases
Solution Approach 1:
The printed circuit board performs multiple functions: it provides mechanical support for the semiconductor chip, establishes electrical connections between the chip terminals and external circuitry, and creates separate low-inductance paths for power and control signals. This multi-functionality reduces overall device complexity despite the increased number of connection pads.
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~4
AI summary
The invention relates to a discrete electronic component (400) comprising: a semiconductor chip (110) comprising a transistor, the chip comprising a first metallization for connection to a first conduction region of the transistor; and a printed circuit board (360) comprising first and second disjoint connection pads, in which: the chip (110) is mounted on the printed circuit board (360) so that the first metallization of the chip is in contact with the first and second connection pads of the printed circuit board (360); and the assembly comprising the semiconductor chip (110) and the printed circuit board (360) is encapsulated in a housing (390) made of an insulating material leaving accessible the first (394) and second (397) connection terminals of the component, connected, inside the housing, respectively to the first and second connection pads of the printed circuit board (360).