Discrete Flexible Interconnects for IC Modules
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Solution Overview
Problem
Conventional microchips and printed circuit boards are rigid, making them incompatible with applications requiring elasticity, leading to damage and unreliability under rigorous use scenarios due to the inability of interconnecting components to flex and conform to shape changes, and existing flexible interconnects experience increased resistance with mechanical strain.
Innovation Solution
Development of extremely stretchable interconnects capable of withstanding high translational and rotational strains while maintaining electrical performance, fabricated as separate components from IC islands and attached to connection pads, using pliant metal wires, multi-layer semiconductors, or conductive paste, allowing for flexible electronic circuitry configurations without material waste or shape restrictions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional rigid microchips and printed circuit boards are used, then structural strength and stability are maintained, but flexibility and ability to conform to shape changes are lost
Solution Approach 1:
The interconnect structure is divided into multiple segments including rigid portions (for structural strength) and flexible portions (for adaptability). This segmentation allows different parts of the interconnect to perform different functions - maintaining strength where needed while providing flexibility where required to conform to shape changes.
Solution Approach 2:
The interconnect employs composite construction combining rigid materials (such as metal traces on rigid substrates) with flexible materials (such as elastomeric substrates or flexible circuit board materials). This composite approach enables the single interconnect structure to simultaneously provide both structural strength and flexibility for conforming to shape changes.
2Adaptability or versatility
If existing flexible interconnects are used, then flexibility and elasticity are achieved, but electrical resistance increases with mechanical strain
Solution Approach 1:
The interconnect is segmented into rigid portions that maintain stable electrical characteristics and flexible portions that accommodate mechanical deformation. By separating the electrical conduction path into these distinct segments, the rigid portions carry the electrical signal with minimal resistance variation while the flexible portions handle the mechanical strain without significantly affecting electrical performance.
Solution Approach 2:
Different portions of the interconnect are designed with different local qualities - rigid sections with optimized electrical conductivity for stable signal transmission, and flexible sections with optimized mechanical properties for strain accommodation. This local differentiation ensures that electrical performance remains stable even when the interconnect undergoes mechanical deformation in the flexible portions.
3Adaptability or versatility
If discrete flexible interconnects are fabricated separately and attached to IC modules, then manufacturing flexibility and configuration versatility are improved, but assembly complexity increases
Solution Approach 1:
The discrete flexible interconnects are designed with integrated attachment features that combine the interconnect function with the mounting function. This merging allows the interconnect to be attached to IC modules in a single operation, reducing assembly complexity while maintaining the versatility of discrete fabrication and configuration options.
Data Source
AI summary
Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.