Discrete Gate Layouts for Higher-Density Semiconductor FETs

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Solution Overview

Problem

Conventional semiconductor designs face limitations in further miniaturization and efficient utilization of structural features, particularly in FETs, due to restrictive grid structures and fixed cell layouts, leading to inefficiencies in device density and performance.

Innovation Solution

The implementation of flexible gate cut processes to form discrete gate structures and separation regions, allowing for self-aligned patterning and non-rectangular transistor arrangements, combined with backside power distribution networks, enhances device flexibility and density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional grid structures and fixed cell layouts are used, then manufacturing simplicity is maintained, but device density and performance are limited

Engineering Contradiction:
Improvedevice densityVSAvoidlayout flexibility
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The gate structure is segmented into multiple discrete gate structures separated by gate separation regions. This segmentation allows independent control and flexible arrangement of transistor devices, enabling non-rectangular layouts and improved device density without compromising manufacturing feasibility through standardized process steps.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from conventional two-dimensional grid layouts to a more flexible spatial arrangement by introducing gate separation regions that enable non-rectangular transistor reservations. This dimensional flexibility allows optimization of device density in both planar and vertical directions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If gate structures are continuously formed without separation, then manufacturing process is simplified, but device isolation and individual control are compromised

Engineering Contradiction:
Improvedevice isolationVSAvoidprocess complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Gate separation regions are extracted between adjacent gate structures to provide electrical isolation and mechanical separation. This extraction enables individual control of each transistor device while maintaining a relatively simple manufacturing process through standard deposition and etching steps.

Inventive Principle:
Principle #2Taking out (Extraction)

3Area of stationary object

If rectangular transistor arrangements are used, then layout simplicity is maintained, but space utilization efficiency is reduced

Engineering Contradiction:
Improvechip area utilizationVSAvoidlayout flexibility
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The invention employs asymmetric gate separation region configurations that allow non-rectangular transistor reservations. This asymmetry optimizes space utilization by adapting the layout to specific circuit requirements rather than forcing all devices into uniform rectangular arrangements, thereby improving chip area utilization.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS20250374666A1Flexible arrangement of semiconductor devices
Publication Date: 2025.12.04 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US20250374666A1 patent drawing
  • US20250374666A1 patent drawing
  • US20250374666A1 patent drawing

AI summary

A semiconductor device includes a set of transistor devices including respective discrete gate structures, a set of gate separation regions, where each discrete gate structure is disposed between a pair of the gate separation regions. The semiconductor device also includes a set of gate contacts, where each gate contact is connected to a corresponding one of the discrete gate structures.