Discrete Pressure Sensor With Force-Centralizing Front-Panel Assembly
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Solution Overview
Problem
Existing pressure sensors require high processing and assembly precision, and a special installation method, leading to increased costs and limited use scope, hindering their widespread adoption.
Innovation Solution
A discrete pressure sensor with a simple structure, comprising a force centralization sensing board component and a pressure sensing chip, where pressure is centralized and converted into control information for electronic device operation, allowing direct bonding onto a front panel without high installation precision requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If complex circuit design and structure design are used (capacitive sensor), then pressure detection capability is improved, but processing precision and assembly precision requirements increase significantly
Solution Approach 1:
The patent uses a force sensing resistor with a simple resistive layer structure instead of complex capacitive sensors, enabling low-cost manufacturing without requiring high processing precision or special assembly procedures
Solution Approach 2:
The patent extracts the essential pressure sensing function from complex capacitive structures and implements it through a simple resistive layer that changes resistance with applied force, eliminating the need for precise capacitor spacing and complex circuit design
2Measurement precision
If piezoelectric ceramic sensors are used, then pressure magnitude detection is improved, but installation complexity and cost increase
Solution Approach 1:
The patent replaces expensive piezoelectric ceramic components with a simple resistive layer that can be manufactured using standard PCB techniques, eliminating the need for special installation methods and reducing costs
Solution Approach 2:
The force sensing resistor design allows the same component to serve both as the sensing element and the circuit element, eliminating the need for separate piezoelectric ceramic components and special installation procedures
3Reliability
If high processing precision and assembly precision are required, then sensor performance is improved, but use cost increases and use scope is limited
Solution Approach 1:
The patent uses a simple resistive layer structure that can be manufactured with standard tolerances, making the sensor suitable for mass production and wide application across different electronic devices without requiring specialized assembly facilities
Solution Approach 2:
The patent changes the sensing mechanism from capacitive (requiring precise spacing) to resistive (tolerant of manufacturing variations), allowing the sensor to maintain performance across a wider range of manufacturing conditions and applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables low-cost, wide applicability, and easy installation of pressure sensors, facilitating their use in various electronic devices by converting applied pressure into control information for device operation.
Implementation Method 1
a pressure sensing chip 14, configured to sense the pressure applied in the hollowed area 122 and convert the pressure into control information
Data Source
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AI summary
The present invention relates to the field of pressure sensor technologies, and discloses a discrete pressure sensor and an electronic device. The pressure sensor includes a pressure sensing chip and a force centralization sensing board component that is bonded onto the pressure sensing chip. The force centralization sensing board component has a hollowed area, the hollowed area has a force centralization position for centralizing force applied on the force centralization sensing board component, and the force centralization position is disposed against the pressure sensing chip. After pressure is applied in the hollowed area of the force centralization sensing board component, force is centralized to the force centralization position, conveyed to the pressure sensing chip in a centralized manner, and converted into control information to control an external electronic device through a circuit or the like of the electronic device. The discrete pressure sensor has a simple structure, and does not have a high requirement on assembly precision. In an actual application, the discrete pressure sensor is directly bonded onto an inner side of a front panel of the electronic device, and a user may control the electronic device through the discrete pressure sensor by touching and pressing positions in the hollowed area corresponding to the front panel. The discrete pressure sensor has a low requirement on installation, and is applicable in a wide scope.