Laminated Transfer Medium With Discrete Relief Segments
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional laminated transfer media for thermal transfer of fine relief structures suffer from transfer burrs and defects due to the heat resistance and breakability of the resin used, which affects the non-defective rate and productivity.
Innovation Solution
A laminated transfer medium with a fine relief structure section composed of separate discrete pieces, covered by an adhesive layer made of the same resin, which provides high elongation ratio and flexibility, preventing cracking and burrs during thermal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a resin with high heat resistance is used for the fine relief structure, then the heat resistant temperature is improved, but the processing temperature must be increased which decreases processing speed and productivity
Solution Approach 1:
The fine relief structure forming layer is divided into multiple discrete fine relief structure sections instead of being a continuous layer. This segmentation allows each section to be independently formed and transferred, enabling the use of high-hardness resins without compromising transferability, thus resolving the contradiction between heat resistance and processing efficiency
Solution Approach 2:
The patent applies different properties to different parts of the structure by making the fine relief structure sections discrete rather than continuous. This local differentiation in structure allows the resin to have high hardness for heat resistance while the discrete arrangement ensures easy breakability for transfer, resolving the contradiction between heat resistance and productivity
2Stability of the object's composition
If the fine relief structure forming layer is made as a continuous layer, then the structure is complete, but transfer burrs and defects occur during thermal transfer
Solution Approach 1:
The continuous fine relief structure forming layer is segmented into multiple discrete fine relief structure sections. This segmentation prevents the formation of transfer burrs and defects by allowing each discrete section to be transferred independently without the connectivity issues that plague continuous layers, thus improving manufacturing precision while maintaining structural completeness through proper arrangement of discrete sections
3Temperature
If a resin with high hardness is used for the fine relief structure, then the heat resistance is improved, but the breakability decreases causing transfer defects
Solution Approach 1:
By segmenting the fine relief structure into discrete sections, the patent enables the use of high-hardness resins that provide superior heat resistance. The discrete nature of the sections ensures they can still be transferred effectively despite the reduced flexibility, resolving the contradiction between heat resistance and breakability
Solution Approach 2:
The patent applies different structural qualities to different aspects of the fine relief structure - high hardness resin for heat resistance while maintaining discrete section geometry for transferability. This local differentiation in structural properties resolves the contradiction between heat resistance and breakability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the breakability and impact resistance of the fine relief structure section, improving the non-defective rate and enabling efficient thermal transfer without burrs or defects, even with high-hardness resins.
Implementation Method 1
an adhesive layer (6) formed on the fine relief structure section (4)
Implementation Method 2
by using a hot stamp
Implementation Method 3
a portion of the fine relief structure forming layer 104 to be transferred is cut off by melting
Data Source
AI summary
A laminated transfer medium that can be used to make a printed matter or the like which includes a fine relief structure with an improved or even high non-defective rate. The laminated transfer medium can form a transfer laminate which contains a fine relief structure section having a fine relief shape onto a transfer target by using a hot stamp, and characterized in that the laminated transfer medium includes a carrier base, a bonding layer formed on the carrier base, a fine relief structure section having a fine relief shape being disposed on the bonding layer, and an adhesive layer formed on the fine relief structure section, wherein the fine relief structure section is made up of separate discrete pieces positioned to be contained in area to be transferred by using the hot stamp.