Discrete Semiconductor Load Balancing via Thermal Feedback
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In power electronics, monolithic implementations of parallel-connected semiconductor switches result in large chip sizes, low manufacturing yield, and thermal dissipation issues, while parallel-connected discrete devices face unequal current/power dissipation due to operating parameter differences.
Innovation Solution
Implementing a system where discrete semiconductor devices share temperature information via a bus to balance current/power dissipation across the group, with each device adjusting its dissipation based on comparative temperature data to maintain optimal operating conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If monolithic implementations of parallel-connected semiconductor switches are used, then current switching capability is improved, but chip size increases and manufacturing yield decreases
Solution Approach 1:
The patent divides the parallel-connected semiconductor switches into separate monolithic integrated circuits, each containing one or more switches fabricated on individual chips. These discrete monolithic devices are then packaged separately and connected in parallel on a circuit board, achieving high current capability without requiring a single large chip, thus maintaining manufacturing yield.
2Power
If monolithic implementations of parallel-connected semiconductor switches are used, then current switching capability is improved, but thermal dissipation becomes difficult
Solution Approach 1:
By separating the parallel-connected switches into discrete monolithic devices packaged in separate packages, each device has its own thermal path and dissipation point. This segmentation of thermal management allows heat to be distributed across multiple packages and heat sinks rather than concentrated at a single point, improving overall thermal dissipation.
3Manufacturing precision
If parallel-connected discrete devices are used, then manufacturing yield is improved, but current/power dissipation balance deteriorates
Solution Approach 1:
The patent incorporates temperature sensors in each discrete monolithic device that provide feedback about the operating temperature of that device. This temperature information is used to dynamically adjust the current distribution among parallel-connected devices, ensuring that devices operating at higher temperatures receive less current, thereby maintaining balanced power dissipation and improving reliability.
Data Source
AI summary
In a general aspect, an apparatus can include a temperature measurement circuit configured to produce a first signal indicating a first operating temperature of a first semiconductor device and a temperature comparison circuit operationally coupled with the temperature measurement circuit. The temperature comparison circuit can be configured to compare the first signal with a second signal indicating a second operating temperature of at least a second semiconductor device and produce a comparison signal indicating whether the indicated first operating temperature is higher, lower or equal to the indicated second operating temperature. The apparatus can also include an adjustment circuit configured to adjust operation of the first semiconductor device based on the comparison signal.