Disk Array Heat Sink with Metal Bars for Thermal Dissipation

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Solution Overview

Problem

The design of multi-row disk array enclosures faces significant challenges in thermal performance due to increasing power consumption, which traditional solutions like enhancing fan capacity cannot effectively address, as it is limited by space and volume constraints, and results in noise side effects.

Innovation Solution

The enclosure incorporates a heat sink with multiple metal bars arranged on the chassis, contacting disks through notches to transfer heat, and additional metal parts for enhanced thermal dissipation, utilizing copper for high conductivity and simplified manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If fan capacity is enhanced to improve thermal dissipation, then heat dissipation performance is improved, but space constraints and noise increase

Engineering Contradiction:

Improvethermal dissipation performanceVSAvoidnoise

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical fan-based cooling system with a passive heat sink system that utilizes thermal conduction and natural convection. The heat sink comprises a heat dissipation plate in contact with the disk and multiple heat dissipation fins extending from the plate, eliminating moving mechanical parts (fans) while achieving effective thermal dissipation through material thermal conductivity and surface area expansion.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If fan capacity is enhanced to improve thermal dissipation, then heat dissipation performance is improved, but space and volume are constrained

Engineering Contradiction:

Improvethermal dissipation performanceVSAvoidspace constraints

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The heat sink utilizes the vertical dimension by extending multiple heat dissipation fins perpendicular to the heat dissipation plate. This three-dimensional fin structure significantly increases the heat dissipation surface area without proportionally increasing the horizontal space occupation, allowing effective thermal management within compact enclosure volumes.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat dissipation fins create a porous-like structure with multiple channels and surfaces that increase the effective heat transfer area. The finned configuration provides numerous thermal pathways for heat dissipation, similar to how porous materials provide increased surface area, enabling efficient cooling within limited space.

Inventive Principle:

Principle #31Porous materials

3Speed

If power consumption increases to achieve more rapid reading speed, then reading speed is improved, but thermal dissipation challenge increases

Engineering Contradiction:

Improvereading speedVSAvoidthermal dissipation challenge

Core Design Contradiction:

SpeedVSTemperature

Solution Approach 1:

The patent changes the thermal management parameters by using high thermal conductivity materials for the heat dissipation plate and fins, optimizing the fin geometry (height, spacing, thickness) to maximize heat transfer surface area, and ensuring optimal thermal contact between the disk and heat dissipation plate. These parameter optimizations enable the system to handle the increased thermal load from high-power rapid reading operations.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution improves thermal dissipation efficiency by distributing heat across a larger area, reducing disk temperatures by 3 to 5 degrees Celsius without significant increases in chassis temperature, while avoiding the noise and space limitations of traditional fan-based solutions.

Implementation Method 1

Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, in order to position the respective disk and to transfer heat generated by the respective disk to the chassis

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10825483B2Heat sinking enclosure for disk array

Publication Date: 2020.11.03 DELL PROD LP

AI summary

Embodiments of the present disclosure relate to an enclosure for a disk array. The enclosure comprises a chassis for receiving the disk array. Each disk in the disk array is enclosed by a frame. The enclosure also comprises a heat sink including a plurality of metal bars arranged on a bottom face of the chassis. Each of the plurality of metal bars is adapted to contact a respective disk through a notch in the frame of the respective disk, to position the respective disk and to transfer heat generated by the respective disk to the chassis. In the embodiments of the present disclosure, the metal bars may be used not only for reliable positioning of the disks, but also for improving thermal dissipation performance.